123results about How to "Shorten the travel distance" patented technology

A solid-liquid separation device for kitchen waste belongs to the technical field of life appliances and comprises a shell, a drainage body and a separator, wherein a water outlet, a residue outlet and a partition board are arranged on the shell; the partition board is arranged between the water outlet and the residue outlet, the residue outlet is connected with a waste residue barrel by a pipe, the drainage body is arranged at the upper end of the shell, a liquid inlet is arranged at the upper end of the drainage body and is communicated with a downcomer of a basin, a liquid outlet is arranged at the lower end of the drainage body, a horizontal slide rail is arranged at the upper end of the residue outlet along the inner wall of the shell, the separator is arranged between the liquid outlet and the horizontal slide rail, and the separator can slide along the horizontal slide rail. The solid-liquid separation device for kitchen waste is simple, practical and convenient to mount, does not need a power device, saves energy and is friendly to the environment and efficient. The solid-liquid separation device can perform quick and effective solid-liquid separation on residue waste in the basin of a kitchen, is convenient to clean and maintain, provides convenience for life of people and is easy to popularize and use.

To present a impact torque adjusting device of a hydraulic torque wrench capable of enhancing the precision of the magnitude of the impact torque generated by the impact torque generating device of the hydraulic torque wrench, shortening the generation period of impact toques, and enhancing the durability of the impact torque generating device of the hydraulic torque wrench, when rotating in two directions, that is, in normal rotation (when tightening) and in reverse rotation (when loosening). The present invention provides a working fluid path (11b) for communicating with the inside of a liner (7) serving as a high-pressure chamber (H) and a low-pressure chamber (L) at the time of generation of a impact torque is formed, and a valve body (11d) biased in a direction of releasing the working fluid path (11b) is disposed in the working fluid chamber, and at the rear back side of the valve body (11d), an oil chamber (15e) is formed to communicate with a blade insertion part (8a) of a main shaft (8) by way of fluid paths (7c, 7d) formed in liner lids (7a, 7b), and thereby the working fluid path (11b) is narrowed depending on an elevation of the pressure of the working fluid in the blade insertion part (8a) of the main shaft (8) elevating along with an elevation of the working fluid in the high-pressure chamber (H).

The invention provides a crystal bonding method and a crystal bonding machine. The crystal bonding method includes: a crystal extraction step: controlling the swing arm to swing to the crystal extraction position, pushing the wafer on the blue film onto the swing arm suction nozzle through a thimble, Then the swing arm swings to the transfer position; movement control step: control the linear movement of the linear die bonding head to the transfer position; transfer step: when both the swing arm suction nozzle and the linear die bonding head are at the transfer position, control the die bonding The nozzle picks up the wafer on the suction nozzle of the swing arm; the die bonding step: firstly control the linear die bonding head to move to the die bonding position in a straight line, and then control the die bonding nozzle of the linear die bonding head to bond the die to the circuit board. The beneficial effects of the present invention are: the present invention makes a relay on the crystal element at the transfer position through the swing arm suction nozzle and the linear die bonding head, shortens the moving stroke of the linear die bonding head, and adopts the die bonding method and die bonding method of the present invention The crystal machine can not only fix larger circuit boards, but also greatly improve the handling speed of wafers, resulting in higher efficiency.

The invention relates to a detent device, a moving mechanism and an aircraft. According to one aspect of the invention, the detent device (100) which is used for the moving mechanism of the aircraft (AC) is provided. The moving mechanism is connected to a fixing structure (30) of the aircraft to enable the moving mechanism to move relative to the fixing structure, the detent device includes a first detent portion (120) arranged at the moving mechanism and a second detent portion (140) arranged at the fixing structure, and the first detent portion is suitable for abutting against the second detent portion to limit the motion range of the moving mechanism through the detent device when a drive connecting structure of the moving mechanism loses efficacy. At least one of the first detent portion and the second detent portion includes a buffering region (BR) which is produced by changing a mesoscopic structure and has decreasing density to be suitable for reducing live load generated by thecollision of the first detent portion and the second detent portion. According to the detent device, the moving mechanism and the aircraft, and the detent device with improved buffering performance can be easily and reliably formed.