The invention discloses a
wafer self-adaptive grabbing
system and method based on dynamic force feedback, and belongs to the technical field of
semiconductor material
processing and carrying. According to the
system, an edge-lower support fusion type clamping jaw structure is adopted, a micro
MEMS pressure sensor array is integrated, and sub-Newton level force control precision is achieved through a double-closed-loop
PID control algorithm. The
system comprises a miniature
force sensor integration module, a dynamic force
feedback control module and an edge-lower support fusion type clamping jaw structure, and can effectively solve the problems of
stress concentration, temperature deformation and the like in the ultrathin
wafer carrying process. The control method disclosed by the invention is combined with a working condition self-adaptive adjustment strategy, supports
modes of sensitive edge protection,
pressure balance, high-speed stability and the like, can switch working
modes in real time according to
wafer states and environmental conditions, dynamically adjusts operation parameters, and provides a solution for precise carrying of third-generation
semiconductor ultrathin materials.