Method and apparatus for depositing films

Abstract

The disclosure relates to a method for depositing films on a substrate which may form part of an LED or other types of display. In one embodiment, the disclosure relates to an apparatus for depositing ink on a substrate. The apparatus includes a chamber for receiving ink; a discharge nozzle having an inlet port and an outlet port, the discharge nozzle receiving a quantity of ink from the chamber at the inlet port and dispensing the quantity of ink from the outlet port; and a dispenser for metering the quantity of ink from the chamber to the inlet port of the discharge nozzle; wherein the chamber receives ink in liquid form having a plurality of suspended particles and the quantity of ink is pulsatingly metered from the chamber to the discharge nozzle; and the discharge nozzle evaporates the carrier liquid and deposits the solid particles on the substrate.

Description

[0001]The instant application claims priority to Provisional Application No. 60 / 944,000 entitled “METHOD AND APPARATUS FOR DEPOSITING FILMS,” filed Jun. 14, 2007, which is incorporated herein by reference in its entirety.BACKGROUND[0002]1. Field of the Invention[0003]The disclosure relates to a method and apparatus for efficiently depositing patterns of films on a substrate. More specifically, the disclosure relates to a method and apparatus for depositing films on a substrate which may form part of an LED or other types of display.[0004]2. Description of Related Art[0005]The manufacture of organic light emitting devices (OLEDs) requires depositing one or more organic films on a substrate and coupling the top and bottom of the film stack to electrodes. The film thickness is a prime consideration. The total layer stack thickness is about 100 nm and each layer is optimally deposited uniformly with an accuracy of better than ±1 nm. Film purity is also important. Conventional apparatuse...

Images