Semiconductor light emitting device
a technology of light-emitting devices and semiconductors, which is applied in the direction of semiconductor devices, basic electric elements, electrical appliances, etc., can solve the problems of reducing productivity, compactness of semiconductor light-emitting devices, and requiring low electric power, so as to reduce the deviation in the thickness of the phosphor without increasing the manufacturing process, and improve the manufacturing efficiency
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first embodiment
[0067]The inventors of the present application focused attention on a point that corners of a space for wire bonding on conventional rectangular substrates do not function efficiently as a pad for wire bonding, in spite that the corners are one of the factors that affect a minimum size of cup-like reflection members and lenses. This embodiment provides a semiconductor light emitting device in which corners of a space for wire bonding are improved in shape. The semiconductor light emitting device of the present invention can be set in a smaller space than conventional ones without sacrificing light distribution characteristic and productivity. Also, the semiconductor light emitting device of the present invention enables to reduce the amount of materials and to improve light focusing efficiency.
[0068]FIG. 1 shows an appearance of a lighting device 10 that comprises a number of light emitting modules respectively including semiconductor light emitting devices of the first embodiment.
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modification example 1
[0112]The modification example 1 of the present invention shows a modification of a shape of the pad area described in the first embodiment.
[0113]The shape of the pad area is not limited to isosceles trapezoidal described in the first embodiment. The pad area can be other trapezoids, isosceles triangles, other triangles, circular arcs, and half regular polygons.
[0114]FIG. 8A and FIG. 8B show semiconductor light emitting devices whose pad areas are trapezoids viewed at a point where the light is received therefrom. In a semiconductor light emitting device 300 shown in FIG. 8A, the mount area has an extended long side. In a semiconductor light emitting device 310 shown in FIG. 8B, the mount area has a not-remarkably-extended long side.
[0115]In the semiconductor light emitting devices 300 and 310, the long base of the isosceles trapezoid coincides with a short side of the mount area.
[0116]FIG. 9A and FIG. 9B show semiconductor light emitting devices whose pad areas are triangles viewed...
modification example 2
[0127]The modification example 2 shows one example of arrangement patterns unique to the present invention in a case where the pad area is a triangle.
[0128]FIG. 12 shows one example of arrangement patterns unique to the present invention.
[0129]In FIG. 12, shaded parts indicate the submount substrates whose pad areas are triangles, and each broken line indicates positions to be cut by dicing. When cutting off a shaded part 400 at the upper left, for example, it is preferable to cut it along the broken lines in the ascending order of the reference numbers, from 401 to 405, because chipping can be prevented by cutting the longer sides first.
[0130]Also, in FIG. 12, it is possible to make the pad area trapezoidal by cutting along the broken line 406 with a thick blade.
[0131]FIG. 13 is one example of the sheets of the submount substrates on which all of the semiconductor light emitting elements are connected by bump connecting.
[0132]In FIG. 13, the semiconductor light emitting elements ar...
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