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Rolled Copper Foil and Manufacturing Method of Rolled Copper Foil

a manufacturing method and technology of copper foil, applied in manufacturing tools, heat treatment equipment, printed circuit aspects, etc., can solve the problems of product failure, difficult control of working ratio per rolling pass, and material (copper foil) becoming harder due to hardness, etc., to improve flexible fatigue properties, excellent flexible fatigue properties, and low cost

Inactive Publication Date: 2009-07-09
SH COPPER PROD CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0030]According to the present invention, it is possible to provide a rolled copper foil which is suitable to flexible wiring materials such as for flexible printed circuit boards and has an excellent flexib

Problems solved by technology

In a case where the copper foil is in an annealed (softened) state, the copper foil is easy to deform (e.g., elongation, creasing, flexing, etc.) upon cutting of the copper foil or lamination with the base material, resulting in a product failure.
In cold rolling working, however, as the final rolling working ratio increases, the material (copper foil) becomes harder due to work hardening.
It then becomes difficult to control the working ratio per rolling pass, lowering the efficiency of copper foil manufacturing.
Specifically, when the total working ratio reaches about 90% (particularly, 93% or more), control of the working ratio per rolling pass and rolling itself become rapidly difficult.

Method used

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  • Rolled Copper Foil and Manufacturing Method of Rolled Copper Foil
  • Rolled Copper Foil and Manufacturing Method of Rolled Copper Foil
  • Rolled Copper Foil and Manufacturing Method of Rolled Copper Foil

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Experimental program
Comparison scheme
Effect test

first embodiment

of the Present Invention

[0050](In-Plane Alignment Measurement)

[0051]A rolled copper foil in this embodiment is the rolled copper foil after the final cold rolling step but before recrystallization annealing. In results obtained by the X-ray diffraction pole figure measurement with respect to the rolled surface, the rolled copper foil includes a group of crystal grains which exhibits four-fold symmetry, in which at least four peaks of a {220}Cu plane diffraction of a copper crystal due to the group of crystal grains exhibiting the four-fold symmetry, which is obtained by β axis scanning with an α angle set to 45°, appear at intervals of 90°±5° along the β angle. For example, when the rolling direction of the copper foil is set to 0° of β angle in the pole figure measurement, centers of the four-fold symmetric peaks are approximately 0° (360°), 90°, 180°, and 270° of β angle.

[0052]If the {220}Cu plane diffraction peaks do not exhibit four-fold symmetry at intervals of 90°±5° in the XR...

second embodiment

of the Present Invention

[0053](Normalized Intensity)

[0054]A rolled copper foil in this embodiment is also the rolled copper foil after the final cold rolling step but before recrystallization annealing. When normalized intensity of the {220}Cu plane diffractions of the copper crystal in results obtained by the XRD pole figure measurement with respect to the rolled surface by the β axis scanning at respective α angles are plotted on a vertical axis with the α angle on a horizontal axis, the maximum value P of the normalized intensity appears in a range of the α angle from 25° to 35°, the maximum value Q of the normalized intensity appears in the range of the α angle from 40° to 50°, the normalized intensity increases monotonically in the range of the α angle from 85° to 90°, and the maximum value P, the maximum value Q, and the normalized intensity R at the α angle of 90° have the relation of “Q≦P≦R”. If, in result obtained by the above XRD pole figure measurement, the normalized int...

third embodiment

of the Present Invention

[0061](2θ / θ Measurement)

[0062]In results obtained by X-ray diffraction 2θ / θ measurement carried out for the rolled surface, a rolled copper foil after the final cold rolling step but before recrystallization annealing in this embodiment has a relation that diffraction peak intensity of the {200}Cu plane is equal to or greater than that of the {220}Cu plane (I{200}Cu≧I{220}Cu), where “I” means the intensity of a diffraction peak of the copper crystal.

[0063]As described before, when the rolled copper foil according to the present invention is in a state after the final cold rolling step has been applied and before recrystallization annealing is performed, the {200}Cu plane is aligned at the rolled surface of the copper foil. This means that the rolled surface of the copper foil includes a significant amount of crystal grains oriented to the {200}Cu plane. FIG. 3 is an example of a diffraction pattern by X-ray diffraction 2θ / θ measurement carried out for a rolle...

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Abstract

A rolled copper foil, according to the present invention, obtained after a final cold rolling step but before recrystallization annealing includes a group of crystal grains which exhibits four-fold symmetry in results obtained by X-ray diffraction (XRD) pole figure measurement with respect to a rolled surface. In the XRD pole figure measurement, at least four peaks of a {220}Cu plane diffraction of a copper crystal due to the group of crystal grains exhibiting the four-fold symmetry, which is obtained during β axis scanning with an α angle set to 45°, appear at intervals of 90°±5° along the β angle.

Description

CLAIM OF PRIORITY[0001]The present application claims priority from Japanese patent application serial no. 2008-112476 filed on Apr. 23, 2008, which further claims priority from Japanese patent application serial no. 2008-001069 filed on Jan. 8, 2008, the contents of which are hereby incorporated by reference into this application.BACKGROUND OF THE INVENTION[0002]1. Field of the Invention[0003]The present invention concerns a rolled copper foil and, particularly, it relates to a rolled copper foil which has an excellent flexible fatigue property suitable for flexible wiring materials such as flexible printed circuits.[0004]2. Description of Related Art[0005]Flexible printed circuit (hereinafter simply referred to as FPC) boards have high freedom in a mounting form to electronic equipment due to their attractive features of small thickness and excellent flexibility. Accordingly, FPC boards have been used generally as, e.g., wirings for bending portions of foldable (clamshell type) ce...

Claims

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Application Information

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IPC IPC(8): C22C9/00C21D1/55
CPCC22C9/00H05K1/0393H05K2203/0143H05K2201/0355H05K1/09
Inventor MUROGA, TAKEMISASAKI, GENYAMAMOTO, YOSHIKISEKI, SATOSHI
Owner SH COPPER PROD CO LTD
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