Rolled Copper Foil and Manufacturing Method of Rolled Copper Foil

a manufacturing method and technology of copper foil, applied in manufacturing tools, heat treatment equipment, printed circuit aspects, etc., can solve the problems of product failure, difficult control of working ratio per rolling pass, and material (copper foil) becoming harder due to hardness, etc., to improve flexible fatigue properties, excellent flexible fatigue properties, and low cost
US20090173414A1Inactive Publication Date: 2009-07-09SH COPPER PROD CO LTD
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Patent Information

Authority / Receiving Office
US · United States
Current Assignee / Owner
SH COPPER PROD CO LTD
Publication Date
2009-07-09
Estimated Expiration
Not applicable · inactive patent

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Abstract

A rolled copper foil, according to the present invention, obtained after a final cold rolling step but before recrystallization annealing includes a group of crystal grains which exhibits four-fold symmetry in results obtained by X-ray diffraction (XRD) pole figure measurement with respect to a rolled surface. In the XRD pole figure measurement, at least four peaks of a {220}Cu plane diffraction of a copper crystal due to the group of crystal grains exhibiting the four-fold symmetry, which is obtained during β axis scanning with an α angle set to 45°, appear at intervals of 90°±5° along the β angle.
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Description

CLAIM OF PRIORITY

[0001] The present application claims priority from Japanese patent application serial no. 2008-112476 filed on Apr. 23, 2008, which further claims priority from Japanese patent application serial no. 2008-001069 filed on Jan. 8, 2008, the contents of which are hereby incorporated by reference into this application.BACKGROUND OF THE INVENTION

[0002] 1. Field of the Invention

[0003] The present invention concerns a rolled copper foil and, particularly, it relates to a rolled copper foil which has an excellent flexible fatigue property suitable for flexible wiring materials such as flexible printed circuits.

[0004] 2. Description of Related Art

[0005] Flexible printed circuit (hereinafter simply referred to as FPC) boards have high freedom in a mounting form to electronic equipment due to their attractive features of small thickness and excellent flexibility. Accordingly, FPC boards have been used generally as, e.g., wirings for bending portions of foldable (clamshell type) ce...

Claims

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