Memory Module Assembly Including Heat Sink Attached To Integrated Circuits By Adhesive And Clips

Abstract

A memory module assembly includes two-plate heat sink attached to one or more of the integrated circuits (e.g., memory devices) of a memory module PCBA by adhesive. The adhesive is either heat-activated or heat-cured. The adhesive is applied to either the memory devices or the heat-sink plates, and then compressed between the heat-sink plates and memory module using a fixture. The fixture is then passed through an oven to activate / cure the adhesive. The two heat sink plates are then secured by a clip to form a rigid frame.

Description

CROSS-REFERENCE TO RELATED APPLICATIONS[0001]The present application is a divisional of U.S. application Ser. No. 11 / 691,452, filed Mar. 26, 2007 which is a continuation-in-part of co-owned U.S. application Ser. No. 10 / 956,893, filed Sep. 29, 2004, entitled “MEMORY MODULE ASSEMBLY INCLUDING HEAT SINK ATTACHED TO INTEGRATED CIRCUITS BY ADHESIVE”, now U.S. Pat. No. 7,215,551, which is incorporated herein by reference in its entirety.FIELD OF THE INVENTION[0002]This invention relates to standardized memory modules for expanding the memory capacity of personal computers and other computing systems, and more particularly to memory module assemblies that include heat-sink structures.BACKGROUND OF THE INVENTION[0003]Heat sinks have been widely used to assist in cooling electronic components. Some microprocessors have heat sinks attached to allow for higher-frequency operation. Other components such as memory modules may also benefit from heat sinks.[0004]Most personal computers (PC's) are ...

AI Technical Summary

Benefits of technology

The present invention is a memory module assembly that includes heat-sink plates that are directly attached to the integrated circuits (IC) devices of a memory module printed circuit board assembly (PCBA) using an adhesive. This method simplifies the manufacturing process and reduces production costs. The heat-sink plates protect the memory module PCBA and dissipate heat generated by the IC devices. The adhesive is applied to the IC devices or the heat-sink plates, and the assembly is then heated to activate the adhesive. The heat-activated adhesive is thin and thermally conductive, reducing thermal resistance and facilitating heat flow. The use of heat-activated and heat-cured adhesive prevents unauthorized tampering and ensures reliable assembly. The heat-sink plates can also be attached using clips for added strength. Overall, the invention provides a thinner and more reliable memory module with heat-sink plates that reduces manufacturing costs and prevents unauthorized tampering.

Problems solved by technology

In both cases, unauthorized tampering (i.e., removal of the heat-sink plates to access the IC devices) is rendered more difficult and easier to detect than conventional memory modules that utilize clips or fasteners.

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