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Flexible circuit board

a flexible circuit board technology, applied in printed circuits, printed circuit details, electrical devices, etc., can solve problems such as increasing the possibility of joint portions breaking under for

Active Publication Date: 2010-02-04
HIMAX TECH LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The present invention provides a flexible circuit board that reduces the likelihood of breakage at joint points and connection points under force. The flexible circuit board includes a flexible film, inner leads, outer leads, and connection portions. The inner leads are formed on the flexible film and have a narrower width, while the outer leads are formed on the flexible film and have a wider width. Each connection point connects an inner lead with an outer lead. The connection points have rounded concave and convex sections to increase flexibility and prevent breakage. The inner and outer edges of the circuit board can be opposite each other. The technical effect of this invention is to provide a flexible circuit board that is more durable and reliable under force.

Problems solved by technology

Each of the indentations 2 is a rounded concave section of the interior side, which could alleviate the mechanical stress of an inner side 2a of the joint portion of the outer lead 1a and the connection portion 1c. However, the joint portion 2b of the inner lead 1b and the connection portion 1c is a sharp corner, thereby still suffering a high stress concentration that increases the possibility that the joint portion 2b may break under force.

Method used

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Examples

Experimental program
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first embodiment

[0035]Referring to FIG. 6, which is a schematic diagram of a flexible circuit board 20 of the present invention. The flexible circuit board 20 has a plurality of inner leads 36, a plurality of connection portions 38, and a plurality of outer leads 40. Each of the connection portions 38 connects a corresponding one of the inner leads 36 with a corresponding one of the outer leads 40. As shown in FIG. 6, a group 32 of the connection portions 38 is located between a group 30 of the inner leads 36 and a group 34 of the outer leads 40. Each of the inner leads 36 has a first width W1, and each of the outer leads 40 has a second width W2. The second width W2 is greater the first width W1. According to other preferred embodiments of the present invention, a ratio of the second width W2 to the first width W1 is greater than or equal to 3. However, the present invention is not limited thereto. Either the inner leads 36 or the outer leads 40 are parallel and equally spaced. In other words, a f...

second embodiment

[0040]Referring to FIG. 11, which is a schematic diagram of the inner lead 36′, the connection portion 38′ and the outer lead 40′ according to the present invention. In the embodiment, the inner edge 42 is connected to the left sides of the inner lead 36′ and the outer lead 40′, and the outer edge 44 is connected to the right sides of the inner lead 36′ and the outer lead 40′.

third embodiment

[0041]Referring to FIG. 12, which is a schematic diagram of the inner lead 36′, the connection portion 38′ and the outer lead 40′ according to the present invention. In the embodiment, the inner edge 42 is connected to the right sides of the inner lead 36′ and the outer lead 40′, and the outer edge 44 is connected to the left sides of the inner lead 36′ and the outer lead 40′. Moreover, the outer edge 44 further has a fourth rounded convex section 53, which is located between the first rounded convex section 52 and the second rounded concave section 54. In the embodiment, a middle section 55 that connects to the first rounded convex section 52 and the fourth rounded convex section 53 is straight. However, it should be noted that the present invention is not limited thereto. For example, the middle section 55 could be another rounded convex section.

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Abstract

A flexible circuit board uses a specific structure to alleviate mechanical stress thereof. The flexible circuit board has a flexible film, a plurality of inner leads, a plurality of outer leads, and a plurality of connection portion. Each of the connection portions a corresponding one of the inner leads with a corresponding one of the outer leads. A first width of the inner leads is greater than a second width of the outer leads. Due to rounded concave sections and rounded convex sections of the connection portions, if the flexible circuit board is bent, the mechanical stress around corners of joint portions of the connection portions with the inner leads and the outer leads could be alleviated.

Description

BACKGROUND OF THE INVENTION[0001]1. Field of Invention[0002]The present invention is related to flexible circuit board, and more specifically, to a flexible circuit board having a specific structure to alleviate mechanical stress thereof.[0003]2. Description of Related Art[0004]With the development of packaging technology, chip on film (COF) bonding technology has become one of the progressive packaging technologies. Generally, COF bonding technology can be applied broadly, for example, the electrical connection between a liquid crystal panel and a driver IC is one of the applications using COF bonding technology.[0005]Referring to FIGS. 1 and 2. FIG. 1 is a cross-sectional diagram of an electronic apparatus 4, and FIG. 2 is a cross-sectional diagram of another electronic apparatus 6. Each of the electronic apparatuses 4 and 6 could be, for example, a thin film transistor liquid crystal display (TFT-LCD), a plasma display, an organic light-emitting diode display (OLED), etc. Each of...

Claims

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Application Information

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Patent Type & Authority Applications(United States)
IPC IPC(8): H05K1/02
CPCH05K1/028H05K2201/10681H05K2201/09727
Inventor YANG, KAI-CHI
Owner HIMAX TECH LTD