Heat dissipation apparatus incorporating a fan

Abstract

A heat dissipation apparatus includes a heat sink and a fan. The heat sink includes a plurality of radial first and second fins. The first and second fins each include a main body and an extension arm extending upwardly from the main body. The main bodies and the extension arms cooperatively form a space therebetween for securely receiving the fan therein. Each extension arm defines an engaging groove communicating with the space. A height of the extension arm of each second fin is less than that of the extension arm of each first fin. A fixing recess is defined over the extension arms of the second fins. The fan includes a frame extending downwardly out a plurality of legs and radially out a fixing arm. The legs have hooks engaging in the engaging grooves, and the fixing arm is fixed in the fixing recess.

Description

CROSS-REFERENCE TO RELATED APPLICATION[0001]Relevant subject matter is disclosed in co-pending U.S. patent application Ser. No. 12 / 331,391, filed on Dec. 9, 2008, both of which are assigned to the same assignee as the present application. The disclosure of the co-pending application is incorporated herein by reference.BACKGROUND[0002]1. Technical Field[0003]The present disclosure generally relates to heat dissipation, and particularly to a heat dissipation apparatus utilizing a fan for enhancing a dissipating efficiency.[0004]2. Description of Related Art[0005]It is well known that if heat generated by electronic components, such as integrated circuit chips, during operation is not efficiently dissipated, these electronic components may suffer damage. Thus, heat dissipation apparatuses are often used to cool the electronic components.[0006]A typical heat dissipation apparatus includes a heat sink and a fan. The heat sink is thermally connected with a heat generating electronic compo...

AI Technical Summary

Benefits of technology

The present patent is about a heat dissipation apparatus that uses a fan for enhancing efficiency. The technical effect of this invention is to simplify the assembly process of the heat dissipation apparatus by eliminating the need for multiple screws to secure the fan to the heat sink.

Problems solved by technology

It is well known that if heat generated by electronic components, such as integrated circuit chips, during operation is not efficiently dissipated, these electronic components may suffer damage.

However, in the heat dissipation apparatus, the fan is assembled to the heat sink via the plurality of screws, which complicates the assembly of the heat dissipation apparatus.

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