Radiating package module for exothermic element

Abstract

Disclosed herein is a radiating package module for an exothermic element. The radiating package module includes a heat conducting plate which has a groove of an internal thread shape, with the exothermic element being mounted on a surface of the heat conducting plate. A heat pipe is inserted into the groove in a screw-type coupling manner and has a coupling part of an external thread shape. An adhesive is applied between the groove and the coupling part. A cooling unit is coupled to an end of the heat pipe. The radiating package module maintains the reliability with which the radiating package radiates heat and improves structural reliability.

Description

CROSS REFERENCE TO RELATED APPLICATION(S)[0001]This application claims the benefit of Korean Patent Application No. 10-2009-0078131, filed on Aug. 24, 2009, entitled “RADIATING PACKAGE MODULE IN EXOTHERMIC ELEMENT”, which is hereby incorporated by reference in its entirety into this application.BACKGROUND OF THE INVENTION[0002]1. Technical Field[0003]The present invention relates to a radiating package module for an exothermic element.[0004]2. Description of the Related Art[0005]The quantity of light of a luminous element is very susceptible to the design of a radiating package. Considering that the luminous element emits in the form of heat about 60%˜80% of the power which is applied, the thermal design of the radiating package is very important in terms of luminous efficiency of the luminous element and thermal reliability. Also, in a package module on which an exothermic element as well as the luminous element is mounted, the efficiency of the module is considerably affected by t...

AI Technical Summary

Benefits of technology

[0011]The present invention is intended to provide a radiating package module for an exothermic element which is capable of improving structural reliability by changing a coupling shape in place of a simple coupling method using solder paste or thermal grease.

[0012]Further, the present invention is intended to provide a radiating package module for an exothermic element, in which a groove of a heat conducting plate and a coupling part of a heat pipe have a thread shape and are coupled to each other in a screw-type coupling manner, micro patterns are provided on the groove of the heat conducting plate and a surface of the coupling part of the heat pipe, and a polymer core is added to solder paste or thermal grease, thus improving both the reliability of radiating heat and structural reliability.

Problems solved by technology

The quantity of light of a luminous element is very susceptible to the design of a radiating package.

Such a forcible fitting method impairs the surface of the heat pipe, so that water may leak out of the heat pipe in a reliability test.

In the case where solder paste is used as an adhesive, a bonded state may become poor when the heat pipe and the heat conducting plate are coupled to each other in a reflow process.

Therefore, the radiating package module is problematic in that a crack may occur in a test for high temperature reliability, impact or vibration.

Especially, a crack may occur between solder paste material and the heat pipe or between solder paste material and the heat conducting plate because of external vibration, so that thermal resistance increases at a contact surface, and thus the lifespan of the package may be reduced.

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