Printed circuit board manufacturing system
a manufacturing system and printed circuit board technology, applied in the direction of manufacturing tools, dielectric characteristics, printed element electric connection formation, etc., can solve the problems of limiting the flexibility of substrate design, affecting the process conformity, and preventing the electronic connection between via and pad. achieve the effect of improving the process conformity
Inactive Publication Date: 2011-06-16
SAMSUNG ELECTRO MECHANICS CO LTD
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Benefits of technology
This approach enhances the alignment and integrity of electronic connections between pads and vias, allowing for more flexible substrate designs and improved circuitry integration by maintaining precise control over the via hole formation process, even with partial or non-linear substrate deformations.
Problems solved by technology
This may be an obstruction for integration of circuitry on substrate, by limiting flexibility of substrate design.
In this case, using the information of pad220 in design data may not guarantee the electronic connection between via and pad.
Meanwhile, linear scale compensation on the information about limited numbers of fiducial marks can not deal with the complicated non-linear deformation of substrates that occurs during the manufacturing process.
Method used
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Embodiment Construction
[0026]Embodiments of a printed circuit board manufacturing system and a manufacturing method thereof according to certain aspects of the invention will be described below in more detail with reference to the accompanying drawings. In the description with reference to the accompanying drawings, those components are rendered the same reference number that are the same or are in correspondence regardless of the figure number, and redundant explanations are omitted. Also, the basic principles will first be described before discussing the preferred embodiments of the invention.
[0027]Reference will now be made in detail to the embodiments of the present general inventive concept, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the like elements throughout. The embodiments are described below in order to explain the present general inventive concept by referring to the figures.
[0028]FIG. 3 is a diagram of printed circuit board manufa...
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Abstract
A printed circuit board manufacturing system that uses a substrate that includes a pad and an insulation layer covering the pad. The system includes an image sensor part acquiring an image of the substrate, a control part generating a control signal to form a via hole, and a laser applying part applying a laser, considering the control signal, to the part of the insulation layer that corresponds to the location information of the pad.
Description
CROSS-REFERENCE TO RELATED APPLICATIONS[0001]This application is a U.S. divisional application filed under 37 USC 1.53(b) claiming priority benefit of U.S. Ser. No. 12 / 010,195 filed Jan. 22, 2008, which claims earlier priority benefit to Korean Patent Application No. 10-2007-0074788 filed with the Korean Intellectual Property Office on Jul. 25, 2007, the disclosures of which are incorporated herein by reference.BACKGROUND[0002]1. Field[0003]The present invention relates to a printed circuit board manufacturing system and a manufacturing method thereof.[0004]2. Description of the Related Art[0005]Miniaturization of electronic device is accomplished by miniaturization of electronic parts. Miniaturization of electronic parts does not mean minimized function. Electronic parts must have same functions in limited size. For this, researches for larger integrity have been accomplished.[0006]For larger integrity, structure of printed circuit board is improved from single-layered to multi-lay...
Claims
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IPC IPC(8): H05K3/00B23K26/02B23K26/382
CPCH05K3/0008H05K1/0269H05K2201/09918H05K3/4679H05K2201/0108H05K3/0035Y10T29/49124H05K3/4644H05K3/42
InventorCHO, CHUNG-WOOCHO, SOON-JINSEO, BYUNG-BAEYOO, KI-YOUNGAHN, SEOK-HWAN
OwnerSAMSUNG ELECTRO MECHANICS CO LTD