Method of manufacturing heat sink plate

Abstract

A heat sink manufacturing method includes the steps of positioning a heat conductive sheet on a lower half holding tool of a powder feeder; tightly closing and connecting an upper half holding tool of the power feeder to the lower half holding tool, such that spacers downward extended from the upper half holding tool are in tight contact with the heat conductive sheet; dispensing metal powder on the heat conductive sheet via a powder inlet on the upper half holding tool and under a positive pressure while vibrating the heat conducting sheet for the metal powder to uniformly distribute on the heat conductive sheet; opening the upper half holding tool and spraying an organic liquid on the metal powder for the same to set; and removing the heat conductive sheet from the lower half holding tool and sintering the metal powder to the heat conductive sheet.

Description

FIELD OF THE INVENTION[0001]The present invention relates to a method of manufacturing heat sink plate, and more particularly to a heat sink plate manufacturing method that requires only reduced tool and assembling costs while enables copper powder to uniformly distribute on and be sintered to the heat sink plate.BACKGROUND OF THE INVENTION[0002]With the progress in the scientific and technological fields, the currently available electronic devices have higher and higher operating performance and also produce more heat during the operation thereof. Therefore, the demand for heat sinks with increased heat dissipation efficiency also increases. To enable increased heat dissipation efficiency, most of the conventional heat sinks include a plurality of stacked radiating fin assemblies. Therefore, a lot of manufacturers have engaged in the research and development in radiating fins, and high-efficiency heat sinks have become the most important target in the industrial field now.[0003]Tak...

AI Technical Summary

Benefits of technology

[0010]A primary object of the present invention is to provide a heat sink plate manufacturing method that enables reduced tools and accordingly, reduced tool cost.

[0011]Another object of the present invention is to provide a heat sink plate manufacturing method that has simplified procedures to save the manufacturing and assembling costs.

[0012]A further object of the present invention is to provide a heat sink plate manufacturing method that effectively enables uniform distribution of metal powder on the heat sink plate.

[0013]A still further object of the present invention is to provide a heat sink plate manufacturing method that is able to effectively prevent the heat conductive sheets for forming the heat sink plate from moving during the manufacturing process, and accordingly, prevents the metal powder from shifting before being sintered to the heat conductive sheets.

[0014]A still further object of the present invention is to provide a heat sink plate manufacturing method that ensures good levelness of the manufactured heat sink plate.

[0016]With the heat sink plate manufacturing method of the present invention, only reduced tool and assembling costs are required; the metal powder can be uniformly distributed on the heat conductive sheets; and the problem of shifting metal powder in the process of manufacturing due to moved heat conductive sheets can be effectively prevented.

Problems solved by technology

The CPU will have reduced performance when the heat produced by it constantly increases.

When the heat accumulated in the CPU exceeds a high limit, it will result in shutdown or other serious damages of the computer.

Therefore, it is a very important issue to quickly remove the heat produced by the CPU and other electronic elements of the computer from the computer case.

In brief, the conventional heat sink plate involves complicated manufacturing procedures to complete it.

As a result, high costs are required to prepare a large number of central moulds and filling the metal powder.

In brief, the conventional heat sink plate manufacturing method has the following disadvantages: (1) requiring high mould cost; (2) involving troublesome manufacturing procedures; and (3) increasing the overall manufacturing cost of the heat sink plate.

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