Method of manufacturing heat sink plate

Inactive Publication Date: 2011-07-14
ASIA VITAL COMPONENTS SHENZHEN CO LTD
View PDF5 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0016]With the heat sink plate manufacturing method of the present invention, only reduced tool and assembling costs are required; the metal powder can be uniformly distribu

Problems solved by technology

The CPU will have reduced performance when the heat produced by it constantly increases.
When the heat accumulated in the CPU exceeds a high limit, it will result in shutdown or other serious damages of the computer.
Therefore, it is a very important issue to quickly remove the heat produced by the CPU and other electronic elements of the computer from the computer case.
In brief, the conventional heat sink plate invol

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Method of manufacturing heat sink plate
  • Method of manufacturing heat sink plate
  • Method of manufacturing heat sink plate

Examples

Experimental program
Comparison scheme
Effect test

Example

[0024]In the illustrated first embodiment, the heat conductive sheet 2 is a copper sheet. As can be seen from FIG. 4, the copper heat conductive sheet 2 is positioned on the lower half holding tool 11 of the powder feeder 1, and the lower half holding tool 11 is provided on a top with a receiving space being configured to the shape of the heat conductive sheet 2, so that the heat conductive sheet 2 is fixedly set in the receiving space of the lower half holding tool 11. Then, the upper half holding tool 12 of the powder feeder 2 is tightly closed and connected to the lower half holding tool 11, as shown in FIGS. 5 and 6. As can be seen from FIG. 4, the upper half holding tool 12 is provided on a lower side facing toward the lower half holding tool 11 with a plurality of spacers 121, which are in tight contact with the heat conductive sheet 2 when the upper half holding tool 12 is closed onto the lower half holding tool 11. After the upper half holding tool 12 has been closed and con...

Example

[0027]As can be best seen from FIGS. 4 to 7, in the illustrated second embodiment, the powder feeder 1 is provided below the lower half holding tool 11 with a sliding mechanism 13, such that the lower half holding tool 11 can be sidewardly moved out of the powder feeder 1 via the sliding mechanism 13. The heat conductive sheet 2 is also a copper sheet in the second embodiment. As can be seen from FIG. 4, the copper heat conductive sheet 2 is positioned on the lower half holding tool 11 of the powder feeder 1, and the lower half holding tool 11 is provided on a top with a receiving space being configured to the shape of the heat conductive sheet 2, so that the heat conductive sheet 2 is fixedly set in the receiving space of the lower half holding tool 11. Then, the upper half holding tool 12 of the powder feeder 2 is tightly closed and connected to the lower half holding tool 11, and the closed lower and upper half holding tools 11, 12 are moved back into the powder feeder 1 via the ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

PropertyMeasurementUnit
Pressureaaaaaaaaaa
Electrical conductoraaaaaaaaaa
Heataaaaaaaaaa
Login to view more

Abstract

A heat sink manufacturing method includes the steps of positioning a heat conductive sheet on a lower half holding tool of a powder feeder; tightly closing and connecting an upper half holding tool of the power feeder to the lower half holding tool, such that spacers downward extended from the upper half holding tool are in tight contact with the heat conductive sheet; dispensing metal powder on the heat conductive sheet via a powder inlet on the upper half holding tool and under a positive pressure while vibrating the heat conducting sheet for the metal powder to uniformly distribute on the heat conductive sheet; opening the upper half holding tool and spraying an organic liquid on the metal powder for the same to set; and removing the heat conductive sheet from the lower half holding tool and sintering the metal powder to the heat conductive sheet.

Description

FIELD OF THE INVENTION[0001]The present invention relates to a method of manufacturing heat sink plate, and more particularly to a heat sink plate manufacturing method that requires only reduced tool and assembling costs while enables copper powder to uniformly distribute on and be sintered to the heat sink plate.BACKGROUND OF THE INVENTION[0002]With the progress in the scientific and technological fields, the currently available electronic devices have higher and higher operating performance and also produce more heat during the operation thereof. Therefore, the demand for heat sinks with increased heat dissipation efficiency also increases. To enable increased heat dissipation efficiency, most of the conventional heat sinks include a plurality of stacked radiating fin assemblies. Therefore, a lot of manufacturers have engaged in the research and development in radiating fins, and high-efficiency heat sinks have become the most important target in the industrial field now.[0003]Tak...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): B22F7/04
CPCB22F7/04B22F3/004
Inventor YANG, HSIUWEI
Owner ASIA VITAL COMPONENTS SHENZHEN CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap