Semiconductor power device having a stacked discrete inductor structure

Abstract

A power device includes a discrete inductor having contacts formed on a first surface of the discrete inductor and at least one semiconductor component mounted on the first surface of the discrete inductor and coupled to the contacts. The discrete inductor further includes contacts formed on a second surface opposite the first surface and routing connections connecting the first surface contacts to corresponding second surface contacts. The semiconductor components may be flip chip mounted onto the discrete inductor contacts or wire bonded thereto.

Description

CROSS-REFERENCE TO RELATED APPLICATION[0001]The instant patent application is a continuation patent application of and claims priority to U.S. patent application Ser. No. 11 / 818,219 filed on Jun. 12, 2007 which is herein incorporated by reference in its entirety.BACKGROUND OF THE INVENTION[0002]1. Field of the Invention[0003]The present invention generally relates to semiconductor power devices and more particularly to a semiconductor power device having a stacked discrete inductor structure wherein at least one semiconductor component is stacked on, and electrically coupled to electrodes of, a discrete inductor. Routing connections formed on the discrete inductor provide additional contacts to the at least one semiconductor component.[0004]2. Description of Related Art[0005]It is well known to include a discrete inductor on the printed circuit board when implementing a power converter circuit. For example, the Analogic™ TECH 1 MHz 400 mA Step-Down Converter (AAT1143) requires the u...

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