Heat dissipation device
a heat dissipation device and heat dissipation device technology, which is applied in the direction of lighting, heating apparatus, and semiconductor/solid-state device details, etc., can solve the problems of limited heat dissipation devices, inability to sustain the fast performance of electronic components, and the electrical components to have to deal with substantial hea
Inactive Publication Date: 2011-09-29
HONG FU JIN PRECISION IND (SHENZHEN) CO LTD +1
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Benefits of technology
The present patent is about a heat dissipation device used in electronic devices. The technical problem addressed is the need for a more efficient heat dissipation device that can dissipate the heat of components on both sides of a heat sink, without compromising the space available in the electronic device. The solution involves a heat dissipation device with a mechanism that allows for smooth rotation of a guide plate, which is connected to a fin group and a housing. The guide plate has latching blocks that engage with hooks on the housing, allowing for easy assembly and disassembly. The device can be used in various electronic devices to improve their performance and stability.
Problems solved by technology
With the development of the electronic technology, more and more electronic components are arranged in an electronic device, which causes the electronic components to have to deal with substantial heat.
If the heat is not quickly dissipated from the electronic components, stable and fast performance of the electronic components will not be sustained.
However, decreasing available space in the electronic device limits the number of the heat dissipation device.
Wind created by the electronic fan passes through the guiding device and dissipates the heat of the heat sink.
However, the heat dissipation device may only help dissipating the heat of the components facing the heat sink.
The components arranged on opposite sides of the heat sink or spaced from the heat sink may not get a good dissipation efficiency.
Method used
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[0013]Referring to FIG. 1, a heat dissipation device 100 used in a computer and to be arranged on a circuit board 50 (see in FIG. 4) includes an electronic fan 10, a fin group 20, a housing 30, and a guide plate 40. The electronic fan 10 and the fin group 20 are connected to the housing 30. The guide plate 40 is rotatably connected to the housing 30.
[0014]Referring to FIG. 2, the fin group 20 includes a support bracket 21 and a plurality of parallel and spaced-apart dissipation fins 23. The dissipation fins 23 define a plurality of air passages (not labeled) between neighboring fins 23 for airflow from the electronic fan 10 to flow therethrough to dissipate heat created by the electronic components to the ambient environment.
[0015]The housing 30 includes a top plate 31 and connecting plates 33 extending from opposite edges of the top plate 31. Each connecting plate 33 includes a first connecting portion 331, a second connecting portion 333, and a third connecting portion 335 arrange...
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A heat dissipation device mounted on a circuit board includes an electronic fan, a fin group connected to the electronic fin, and a guide plate arranged near the connection of the electronic fan and the fin group. Airflow from the electronic fan reaches the fin group and the guide plate. The guide plate can divert the direction of the airflow.
Description
BACKGROUND[0001]1. Technical Field[0002]The present disclosure generally relates to heat dissipation devices and, particularly, to a heat dissipation device mechanism used in an electronic device.[0003]2. Description of Related Art[0004]With the development of the electronic technology, more and more electronic components are arranged in an electronic device, which causes the electronic components to have to deal with substantial heat. If the heat is not quickly dissipated from the electronic components, stable and fast performance of the electronic components will not be sustained. Usually, those skilled in the art install a heat dissipation device on an electronic component to help dissipate the heat of the electronic component. However, decreasing available space in the electronic device limits the number of the heat dissipation device. Therefore, a heat dissipation device with high efficiency is needed.[0005]A commonly used heat dissipation device includes an electronic fan, a h...
Claims
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IPC IPC(8): F28F13/00
CPCG06F1/20H01L23/4006H01L2924/0002H01L23/467H01L2924/00
Inventor TANG, XIAN-XIUYE, ZHEN-XING
Owner HONG FU JIN PRECISION IND (SHENZHEN) CO LTD