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Thermal diffuser and cooling apparatus for cooling heat source using the same

Inactive Publication Date: 2011-12-15
DENSO CORP +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0009]To achieve the objective of the present invention, there is provided a thermal diffuser that includes a plurality of thermally-conductive plates, each of which has a strip-like shape. The plurality of thermally-conductive plates is laminated onto one another in a plate-thickness direction of the strip-like shape to form a laminated body. Each of the plurality of thermally-conductive plates has thermal conductivities in a longitudinal direction and in a width direction of the strip-like shape better than a thermal conductivity in the plate-thickness direction. The thermally-conductive plates have sides, each of which extends in the longitudinal direction. The laminated body is formed such that the sides of the thermally-conductive plates form a plate surface of the laminated body, which surface extends in the plate-thickness direction that serves as a lamination direction, in which the thermally-conductive plates of the laminated body are laminated. A direction perpendicular to the plate surface corresponds to a thickness direction of the laminated body.

Problems solved by technology

As a result, the improved thermal conductivity is still very low compared with the thermal conductivity of the metal material, such as copper or aluminum.

Method used

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  • Thermal diffuser and cooling apparatus for cooling heat source using the same
  • Thermal diffuser and cooling apparatus for cooling heat source using the same
  • Thermal diffuser and cooling apparatus for cooling heat source using the same

Examples

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first embodiment

[0028]A cooling apparatus 100A for cooling a heat source in the first embodiment will be described blow with reference to FIG. 1 and FIGS. 2A and 2B. FIG. 1 is an exploded perspective view illustrating the cooling apparatus 100A of the heat source, and FIGS. 2A and 2B are perspective views each illustrating a thermal diffuser 110 made of thermal conductivity plates in FIG. 1.

[0029]As shown in FIG. 1, the cooling apparatus 100A for cooling the heat source (hereinafter, simply referred to as the cooling apparatus 100A) includes the thermal diffuser 110, a heat source 120, an insulating plate 130, and a cooling unit 140. The cooling apparatus 100A cools the heat source 120 by transmitting heat of the heat source 120 to the cooling unit 140 through the thermal diffuser 110.

[0030]As shown in FIG. 2, the thermal diffuser 110 is a plate that efficiently transmits heat of the heat source 120 toward the cooling unit 140, and the thermal diffuser 110 includes multiple thermally-conductive pla...

second embodiment

[0038]FIGS. 3A to 3D show a thermal diffuser 110 of the second embodiment, and more specifically show a manufacturing process of the thermal diffuser 110. The method of manufacturing the thermal diffuser 110 in the second embodiment is different from the manufacturing method in the first embodiment (FIG. 1, FIG. 2).

[0039]The method for manufacturing the thermal diffuser 110 will be described below. Firstly, the plate-shaped thermally-conductive plates 111 having a better thermal conductivity in the plane direction than the thermal conductivity in the plate-thickness direction are prepared (FIG. 3A). The thermally-conductive plates 111 are laminated on one another in the plate-thickness direction to form a laminated body (FIG. 3B).

[0040]Next, the laminated body formed as above is cut in the lamination direction along the one side 111b of the thermally-conductive plate 111 to form a plate member as shown in FIG. 3C. Then, in the plate member, the plate surface 110a of the thermal diff...

third embodiment

[0042]FIGS. 4 to 6 show a cooling apparatus 100B of the third embodiment. In contrast to the first embodiment (FIGS. 1 and 2), the thermal diffuser 110 of the third embodiment is made of multiple thermal diffusers 110A, 110B.

[0043]As shown in FIGS. 4, 5A, and 5B, the thermal diffuser 110 is made of two thermal diffusers (or two laminated bodies). More specifically, the thermal diffuser 110 includes a first thermal diffuser 110A and a second thermal diffuser 1108. Each of the thermal diffusers 110A, 110B is similar to the thermal diffuser 110 described in the first embodiment. The thermal diffuser 110A is arranged such that the lamination direction of the thermally-conductive plates 111 of the thermal diffuser 110A is different from the lamination direction of the thermally-conductive plates 111 of the thermal diffuser 110B. Thus, the adjacent thermal diffusers (laminated bodies) 110A, 110B have the respective lamination directions of the thermally-conductive plates 111 different fro...

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Abstract

A thermal diffuser includes a plurality of thermally-conductive plates, each of which has a strip-like shape. The plurality of thermally-conductive plates is laminated onto one another in a plate-thickness direction of the strip-like shape to form a laminated body. Each of the plurality of thermally-conductive plates has thermal conductivities in a longitudinal direction and in a width direction of the strip-like shape better than a thermal conductivity in the plate-thickness direction. The thermally-conductive plates has sides, each of which extends in the longitudinal direction. The laminated body is formed such that the sides of the thermally-conductive plates form a plate surface of the laminated body, which surface extends in the plate-thickness direction that serves as a lamination direction, in which the thermally-conductive plates of the laminated body are laminated. A direction perpendicular to the plate surface corresponds to a thickness direction of the laminated body.

Description

CROSS REFERENCE TO RELATED APPLICATION[0001]This application is based on and incorporates herein by reference Japanese Patent Application No. 2010-132076 filed on Jun. 9, 2010.BACKGROUND OF THE INVENTION[0002]1. Field of the Invention[0003]The present invention relates to a thermal diffuser that transfers heat of a heat source, such as a semiconductor device, and relates to a cooling apparatus that uses the thermal diffuser to cool the heat source.[0004]2. Description of Related Art[0005]JP-A-2005-272164 shows a conventional thermal diffuser (high thermal conductivity member) for cooling a heat source. The conventional thermal diffuser employs, for example, a graphite structure to replace a metal material, such as copper and aluminum. A single graphite structure (or a graphene) has an a-b axial direction, which extends in a plane direction of the graphene. The thermal conductivity of the graphite structure in the a-b axial direction exceeds 1000 W / mK, and is twice or more of the the...

Claims

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Application Information

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IPC IPC(8): F28F3/00B21D53/02F28F7/00
CPCF28F21/02F28F21/04F28F2265/24H01L23/36H01L23/373Y10T29/4935H05K7/20254H01L23/473H01L2924/0002H01L2924/00
Inventor SAKIMICHI, SATOSHIKOHARA, KIMIONODA, KOJI
Owner DENSO CORP
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