Heat sink structure
a technology of heat sink and structure, which is applied in the direction of lighting and heating apparatus, semiconductor/solid-state device details, electrical products that may overheat and be damaged, and the heat dissipation effect of such a structure on a heat source of very high heat is insufficient, and needs improvement. to achieve the effect of increasing the area of heat dissipation
Inactive Publication Date: 2012-02-16
CHU SU HUA
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- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Benefits of technology
[0010]By coating at least one of the heat dissipating fins with the heat dissipating material, the heat dissipation effect of the heat sink structure is enhanced.
[0012]Preferably, each heat dissipating fin has a serrated edge to increase the area for heat dissipation.
Problems solved by technology
If the heat generated by the heat source during operation of the electronic product is not effectively dissipated, the electronic product may overheat and be damaged as a result.
The heat dissipation effect of such a structure on a heat source of very high heat is insufficient and needs improvement.
Method used
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Embodiment Construction
[0016]FIG. 2 shows a heat sink structure according to a preferred embodiment of the present invention.
[0017]As shown in FIG. 2, a heat sink structure 1 includes a plurality of heat dissipating fins 2 and a plurality of heat dissipating elements 3.
[0018]The heat dissipating fins 2 in the drawing are stacked together and spaced apart from one another by a distance. In addition, each of the heat dissipating fins 2 is coated with a heat dissipating material 21. However, it is understood that the heat dissipating material 21 may be coated on only one of the heat dissipating fins 2 or on certain ones of the heat dissipating fins 2 as needed.
[0019]The heat dissipating elements 3 in FIG. 2 pass through the heat dissipating fins 2 and are each coated with the heat dissipating material 21. However, it is understood that the heat dissipating material 21 may be coated on only one of the heat dissipating elements 3 or on certain ones of the heat dissipating elements 3 as desired.
[0020]In the pre...
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Abstract
A heat sink structure includes a plurality of heat dissipating fins and a plurality of heat dissipating elements. The heat dissipating fins are arranged in a stack and spaced apart from one another by a distance, wherein at least one of the heat dissipating fins is coated with a heat dissipating material. The heat dissipating elements pass through the heat dissipating fins. By coating at least one of the heat dissipating fins with the heat dissipating material, the heat dissipation effect of the heat sink structure is enhanced.
Description
BACKGROUND OF THE INVENTION[0001]1. Technical Field[0002]The present invention relates to a heat sink structure and, more particularly, to a heat sink structure with enhanced heat dissipation effect.[0003]2. Description of Related Art[0004]An electronic product typically has a heat source in the form of a central processing unit, a chip, and so on. If the heat generated by the heat source during operation of the electronic product is not effectively dissipated, the electronic product may overheat and be damaged as a result.[0005]Conventional heat dissipation devices include fans, heat dissipating fins, heat pipes, and combinations thereof.[0006]Referring to FIG. 1 for a perspective view of a conventional heat dissipation structure 9, the heat dissipation structure 9 includes a plurality of heat dissipating fins 91 which are arranged in a stack, spaced apart from one another, and penetrated by a plurality of heat pipes 92. The heat dissipating fins 91 and the heat pipes 92 provide he...
Claims
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Patent Timeline
Login to View More IPC IPC(8): F28F3/08F28F13/18
CPCF28F1/32F28F13/18H01L23/3672H01L23/427H01L2924/0002H01L2924/00
Inventor CHU, SU HUA
Owner CHU SU HUA