Lead-free solder alloy, connecting member and a method for its manufacture, and electronic part

a technology of lead-free solder alloy and connecting member, which is applied in the direction of connecting contact member material, soldering apparatus, manufacturing tools, etc., can solve the problems of inadequate adhesion between the heat dissipating member and the package, voids inside the joints, so as to reduce the amount of voids remaining inside the joints, increase the adhesion and bonding strength of the first member and the second member, and reduce the thickness

Inactive Publication Date: 2012-08-09
SENJU METAL IND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Benefits of technology

[0024]A lead-free solder alloy according to the present invention allows voids to easily escape from a solder joint of a connecting member to a first member or a second member, so the amount of voids remaining inside the joint can be decreased, and the adhesion and bonding strength of the first member and the second member are increased.
[0025]A connecting member according to the present invention can achieve a decrease in thickness, and it has good shape retention when it is punched to form small members or is subjected to rolling, so it has excellent mass producibility and workability.
[0026]A method of manufacturing a connecting membe

Problems solved by technology

Therefore, the strength of the joints and the adhesion between the heat dissipating member and the package are inadequate.
It was al

Method used

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  • Lead-free solder alloy, connecting member and a method for its manufacture, and electronic part
  • Lead-free solder alloy, connecting member and a method for its manufacture, and electronic part
  • Lead-free solder alloy, connecting member and a method for its manufacture, and electronic part

Examples

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example 1

[0087]Examples of the present invention are shown in Table 1 and FIG. 3, and comparative examples are shown in Table 1 and FIG. 4.

TABLE 1Melting temperature (° C.)VoidsComposition (mass %)SolidusLiquidusSuit-rateInSnBitemp.temp.ability(%)Example 199.80.10.1157157◯23.9Example 296.930.1145.7152.4◯25.5Example 396.530.5151.4153.5◯31.3Example 497.90.12149.3154.8◯21.2Example 59532144.7150.9◯32.8Example 699.90.10156156.6◯21Example 79730152.9153.7◯27.9Example 899.900.1156.1156.6◯25.6Example 99802149.5152.8◯21.1Comp. 110000157157◯44.6Comp. 29361145.6149◯42.1Comp. 387.9120.1142.1144.6◯39.1Comp. 486122133.4139.8◯59.9Comp. 574.9250.1131.3133◯53.7Comp. 695.90.14140.1150◯40.4Comp. 794.90.15129.7147.2XNDComp. 869.9300.1127129XNDComp. 999.960.040156156.8◯33.4Comp. 1096.53.50152.1153◯44.3Comp. 1199.9600.04156.1156.8◯33.8Comp. 1297.503145.1151.3◯38.5ND: not determined

[0088]The melting temperature of the solder was measured using a differential thermal analyzer. The analyzer was a DSC 6200 manufacture...

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Abstract

A lead-free solder which can reduce the occurrence of voids and a connecting member which uses the solder and has excellent adhesion, bonding strength, and workability are provided. The lead-free solder alloy has a composition consisting essentially of Sn: 0.1-3% and/or Bi: 0.1-2%, and a remainder of In and unavoidable impurities and has the effect of suppressing the occurrence of voids at the time of soldering. The connecting member is prepared by melting the lead-free solder alloy, immersing a metal substrate in the melt, and applying ultrasonic vibrations to the molten lead-free solder alloy and the metal substrate to form a lead-free solder alloy layer on the surface of the metal substrate.
A heat sink and a package are soldered to each other through this connecting member by reflow heating in the presence of flux.

Description

TECHNICAL FIELD[0001]This invention relates to a lead-free solder alloy, a connecting member and a method for its manufacture, and an electronic part. Specifically, it relates to a lead-free solder alloy which can decrease the occurrence of voids in solder joints, a connecting member using the lead-free solder alloy and a method for its manufacture, and an electronic part using the connecting member.BACKGROUND ART[0002]Decreases in the weight, thickness, and size of electronic parts are being promoted. In particular, miniaturization and densification of semiconductor packages (referred to below as packages) are being pushed with the development of multifunctionality of electronic parts. As a result, there is an upward trend in the amount of heat generated by packages such as BGAs. For this reason, there is a desire to further increase the ability of packages to dissipate heat.[0003]Heat dissipating members which transmit heat to the exterior of packages such as heat sinks or radiati...

Claims

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Application Information

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IPC IPC(8): H01R4/02B23K1/20C22C28/00
CPCB23K35/007B23K35/0238B23K35/26C22C28/00C23C24/103H01L23/3736H01L2924/0002H01L23/495H01R43/0235H01L2924/00B23K1/08B23K1/20
Inventor YOSHIKAWA, SHUNSAKUYAMANAKA, YOSHIEOHNISHI, TSUKASAISHIBASHI, SEIKOWATANABE, KOJIISHIKAWA, HIROKICHIBA, YUTAKA
Owner SENJU METAL IND CO LTD
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