Heat sink device and air flow adjusting frame for the same
a heat sink and air flow technology, which is applied in the field of heat sink devices and air flow adjusting frames of computers, can solve the problems of reducing the service life of the fan, reducing increasing the load of the fan, and preventing the vertical interference of the air flow generated by and enhancing the heat dissipation ability of the heat sink. , the effect of reducing the turbulent flow between the fan and the circuit board
Inactive Publication Date: 2012-11-29
MICRO-STAR INTERNATIONAL
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Benefits of technology
[0009]The disclosure is a heat sink device and an air flow adjusting frame thereof for preventing the problem that when a conventional fan blows, a turbulent flow is easily generated between the fan and the circuit board resulting in decrease of heat dissipation ability and increase of the load of the fan.
[0012]According to the above heat sink device and the air flow adjusting frame for the same, the fan is enabled to pivot relative to the heat dissipation fin due to the air flow adjusting frame, so as to adjust the air flow angle of the fan. Consequently, the vertical interference of the air flow generated by the fan and the circuit board can be prevented, and the turbulent flow between the fan and the circuit board may also be reduced. Also, the heat dissipation ability of the heat sink is enhanced with the work load of the fan being reduced.
Problems solved by technology
Thus, when the air flow generated by the fan blows to the circuit board, the air flow is rebounded back due to the obstruction of the circuit board.
The rebounded air flow and the air flow generated by the fan interfere with each other, so that a turbulent flow is generated between the fan and the circuit board.
With the increasing operation load, the service life of the fan is shortened.
The disclosure is a heat sink device and an air flow adjusting frame thereof for preventing the problem that when a conventional fan blows, a turbulent flow is easily generated between the fan and the circuit board resulting in decrease of heat dissipation ability and increase of the load of the fan.
Method used
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[0022]FIG. 1 is a schematic structural view of a heat sink device according to an embodiment of the disclosure, and FIG. 2 is a schematic exploded structural view of a heat sink device according to an embodiment of the disclosure.
[0023]As shown in FIG. 1 and FIG. 2, the heat sink device 10 of this embodiment is used to dissipate heat generated from an electronic device 20. The electronic device 20 is, but not limited to, a graphics card used inside a computer. For example, the electronic device 20 may also be a main board inside the computer. The electronic device 20 comprises a circuit board 22 and a heat source 21 located on the circuit board 22. The heat source 21 may be a computing chip, for example, a central processing unit (CPU) or graphics chip.
[0024]The heat sink device 10 of this embodiment comprises a heat dissipation fin 200, two air flow adjusting frames 100 and a fan 300. The heat dissipation fin 200 has a first side 201 facing the heat source 21 and a second side 202 ...
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An air flow adjusting frame for a heat sink device which includes a first fixing plate and a second fixing plate is disclosed. The first fixing plate is fixed to a heat dissipation fin with the second fixing plate pivoted to the first fixing plate. Besides, the second fixing plate is for being fixed to a fan. An air flow angle of the fan is adjusted through the air flow adjusting frame.
Description
CROSS-REFERENCE TO RELATED APPLICATIONS[0001]This non-provisional application claims priority under 35 U.S.C. §119(a) on Patent Application No(s). 100209674 filed in Taiwan, R.O.C. on May 27, 2011, the entire contents of which are hereby incorporated by reference.BACKGROUND[0002]1. Technical Field[0003]The disclosure relates to a heat sink device and an air flow adjusting frame thereof, and more particularly to a heat sink device for computer and an air flow adjusting frame thereof.[0004]2. Related Art[0005]In recent years, with the advanced technology, the method of developing and manufacturing electronic devices is well enhanced. Electronic devices is not only heading to the direction of being light in weight and small in size, but also to the direction of having the finest functionality at the same time.[0006]Using computers as an example, with the advanced technology of semiconductors, the volume of the integrated circuit inside the computers is miniaturized. For the purpose of ...
Claims
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Login to View More IPC IPC(8): F28F7/00
CPCG06F1/20
Inventor LIN, YI-CHIEHLIN, YU-JING
Owner MICRO-STAR INTERNATIONAL