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Formed PCB

Bendable, multi-layered PCBs with adjustable stiffness address the challenge of utilizing irregular spaces in portable devices, enhancing manufacturing reliability and device compactness by eliminating flex connectors and optimizing internal space utilization.

Inactive Publication Date: 2013-10-03
APPLE INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

This solution enables more efficient use of internal space, improves manufacturing reliability by reducing the risk of connector failures, and allows for a thinner, more compact device design while maintaining electrical connectivity.

Problems solved by technology

The trend of smaller, lighter, more compact and powerful presents continuing challenges in the design portable computing devices and its associated components.
When the display, display controller and battery are arranged and secured in the housing, a number of irregularly shaped spaces can remain that are not easily utilized, which can lead to unused dead-space within the device.

Method used

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Examples

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Embodiment Construction

[0003]The described embodiments relate generally to computing devices such as laptop computers, tablet computers, and the like. More particularly, internal packaging architectures involving printed circuit board design are described.

[0004]2. Description of the Related Art

[0005]In recent years, portable computing devices such as laptops, PDAs, media players, cellular phones, etc., have become small, light and powerful. One factor contributing to this reduction in size can be attributed to the manufacturer's ability to fabricate various components of these devices in smaller and smaller sizes while in most cases increasing the power and or operating speed of such components. Another factor contributing to the reduction in size is that from a visual stand point, users often find compact and sleek designs of consumer electronic devices more aesthetically appealing and thus, demand compact and sleek designs. The trend of smaller, lighter, more compact and powerful presents continuing cha...

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PUM

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Abstract

Methods for forming PCBs that can be used in a portable computing device are described. The PCBs can be installed in the portable computing device in a bent configuration. In a particular embodiment, a contiguously formed PCB can be shaped with two large regions connected a thin connector portion. The thin connector portion can connect components one each of the two large regions and can be used in lieu of a flex connector. In one embodiment, the PCB can be formed from multiple layers including trace and substrate layers. The trace and substrate layer can be adjusted to affect the stiffness of the PCB in various regions, such as to allow the PCB to hold a bent configuration after a bending moment is applied.

Description

[0001]This application is a continuation of U.S. patent application Ser. No. 12 / 859,712, filed Aug. 19, 2010, which is hereby incorporated in its entirety. This application claims the benefit of and claims priority to U.S. patent application Ser. No. 12 / 859,712, filed Aug. 19, 2010.BACKGROUND[0002]1. Field of the Described Embodiments[0003]The described embodiments relate generally to computing devices such as laptop computers, tablet computers, and the like. More particularly, internal packaging architectures involving printed circuit board design are described.[0004]2. Description of the Related Art[0005]In recent years, portable computing devices such as laptops, PDAs, media players, cellular phones, etc., have become small, light and powerful. One factor contributing to this reduction in size can be attributed to the manufacturer's ability to fabricate various components of these devices in smaller and smaller sizes while in most cases increasing the power and or operating speed...

Claims

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Application Information

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Patent Type & Authority Applications(United States)
IPC IPC(8): H05K7/14G06F1/18
CPCG06F1/1626G06F1/1658H05K1/0281Y10T29/49155H05K2201/056G06F1/181H05K7/1427H05K1/189
Inventor ROTHKOPF, FLETCHER R.HOBSON, PHILLIP M.MITTLEMAN, ADAMSHEDLETSKY, ANNA-KATRINA
Owner APPLE INC
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