The invention discloses a
grinding method and
grinding equipment, and the
grinding method comprises the following steps: S1, after a to-be-processed
wafer on each
wafer bearing table is concentrically placed on the
wafer bearing table, a frame of the to-be-processed wafer is fixed through a fastening device of the wafer bearing table; s2, the wafer bearing table is driven by the indexing table to rotate to the position below the first grinding equipment mechanism; s3, a first plug
assembly is controlled to be connected with a socket
assembly matched with the wafer bearing table, the wafer bearing table adsorbs and fixes the to-be-machined wafer, the wafer bearing table drives the to-be-machined wafer to rotate, and first grinding equipment is started to thin the to-be-machined wafer; s4, after the first grinding equipment mechanism completes
thinning, the first plug
assembly is controlled to be separated from the socket assembly, and then the wafer bearing table is controlled to rotate to the position below the second grinding equipment mechanism through the indexing table; s5, a second plug assembly is controlled to be connected with a socket assembly matched with the wafer bearing table, the wafer bearing table adsorbs and fixes the to-be-machined wafer, the wafer bearing table drives the to-be-machined wafer to rotate, and second grinding equipment is started to thin the to-be-machined wafer; s6, after the second grinding equipment completes
thinning, the second plug assembly is controlled to be separated from the socket assembly, and then the wafer bearing table is controlled to rotate to the feeding and discharging position through the indexing table; and S7, discharging is conducted after fixing of the fastening device to the frame is relieved. The indexing table can always operate in a single direction without interfering with a pipeline, the defect that an indexing table in an existing scheme cannot operate in a single direction is effectively overcome, and invalid idle
stroke of the indexing table is avoided.