Liquid leakage prevention device, liquid leakage prevention method, and liquid cooling system

a technology of liquid leakage prevention and liquid cooling system, which is applied in the direction of lighting and heating apparatus, instruments, and semiconductor/solid-state device details, etc., can solve the problems of liquid leaching from a connection portion of the joint, affecting the reliability of an electronic device, and inability to prevent internal refrigerant liquid from being leaked to the external

Inactive Publication Date: 2013-10-24
HITACHI LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0073]According to the present invention, it is possible to provide a structure in which safe insertion and removal of card boards are enabled without leaking the liquid to the external even if a liqu...

Problems solved by technology

However, in the related art joint as disclosed in JP-A-2009-15869, for example, when the cardboard is attached or detached at the time of operating the system, it is assumed that the internal refrigerant liquid cannot be surely prevented from being leaked to the external by the attachment or detachment work.
Also, there is...

Method used

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  • Liquid leakage prevention device, liquid leakage prevention method, and liquid cooling system
  • Liquid leakage prevention device, liquid leakage prevention method, and liquid cooling system
  • Liquid leakage prevention device, liquid leakage prevention method, and liquid cooling system

Examples

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first embodiment

[0089]FIG. 1 is a cross-sectional view illustrating a structure of a joint according to a first embodiment of the invention, which illustrates a state before a male joint 1 and a female joint 2 are fitted to each other. The joint according to this embodiment includes the male joint 1 and the female joint 2, and housings 3 and 4 that fix those joints to each other. Those housings 3 and 4 include a lock mechanism (not shown) for holding a state where the male joint 1 and the female joint 2 are fixed to each other. A water absorptive material 5 such as a water absorptive polymer is disposed on an inner wall of the housing 3 of the male joint 1, and a seal member 6 such as a rubber packing is disposed on an inner wall of the housing 4 of the female joint 2. In this example, the water absorptive material 5 (water absorptive polymer, etc.) is made of, for example, a material processed into a sheet shape, and has a size or volume as large as at least a liquid having the same volume as that...

second embodiment

[0103]FIG. 11 is a cross-sectional view illustrating a structure of a joint according to a second embodiment of the invention.

[0104]Incidentally, as another means for detecting the liquid leakage, there is proposed a method stated below.

[0105]Referring to FIG. 11, a depression is formed in the inner wall of the housing 3 of the male joint 1, and a pressure sensor 111 is provided within the depression. The pressure sensor 111 is connected to a liquid leakage detector circuit 113 mounted on the card board 9 by a cable 112 passing through the housing 3, and monitors a pressure value applied to the pressure sensor 111. Also, a water swellable water stop material that can absorb at least a liquid of the same volume as that of the space confined in the housing 3 is installed on the inner wall of the housing 3 as the water absorptive material 5.

[0106]FIG. 12 is a cross-sectional view illustrating a behavior at the time of leaking the liquid in the joint structure according to the second em...

third embodiment

[0111]FIG. 14 is a cross-sectional view illustrating a structure of a joint according to a third embodiment of the invention.

[0112]Further, as another means for detecting the liquid leakage, a liquid leakage sensor 141 shown in the figure may be used. Referring to FIG. 14, the water absorptive material 5 (water absorptive polymer, etc.) is disposed on the inner wall of the housing 3 of the male joint 1, and the liquid leakage sensor 141 is installed on the water absorptive material 5 (water absorptive polymer, etc.). There are several types of liquid leakage sensors 141, and as the most general type, for example, paper is wrapped around each of two conductive wires, and the two conductive wires are bundled together, and installed in a place where the liquid leakage is sensed. If the liquid is leaked, water penetrated into paper reduces an electric resistance between the two conductive wires, and the reduction of the electric resistance is electrically sensed to output an alarm. If n...

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PUM

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Abstract

In a liquid cooling system having a structure in which a joint is attached or detached while inserting or removing a card board, when a liquid is leaked from a connection portion of the joint, the leaked liquid confined within a housing is prevented from spilling out and scattering to surrounding electronic components when the card board is disconnected. The liquid cooling system includes male and female joints, and housings that fix those joints to each other. A water absorptive material is disposed on an inner wall of the housing of the male joint, and a seal member is disposed on an inner wall of the housing of the female joint. The liquid cooling system includes a liquid leakage detection function. When the liquid cooling system detects the liquid leakage, the liquid cooling system stops the operation of a pump, and prevents the liquid from being further leaked.

Description

CLAIM OF PRIORITY[0001]The present application claims priority from Japanese patent application JP 2012-095291 filed on Apr. 19, 2012, the content of which is hereby incorporated by reference into this application.BACKGROUND OF THE INVENTION[0002]1. Technical Field[0003]The present invention relates to a liquid leakage prevention device, a liquid leakage prevention method, and a liquid cooling system, and more particularly to a liquid leakage prevention device, a liquid leakage prevention method, and a liquid cooling system for use in an electronic device, having a liquid leakage prevention structure of a pipe joint, and a liquid leakage prevention structure of the pipe joint.[0004]2. Background Art[0005]A semiconductor component used for the electronic device produces heat during operation. There is a need to cool the semiconductor component because the semiconductor component loses a function of semiconductor when the semiconductor component exceeds a given temperature. As a metho...

Claims

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Application Information

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IPC IPC(8): F28F11/00
CPCF28F11/00F28F2265/16F16L21/00F28F27/00F28D15/00H01L23/473F28D2021/0028F28F2230/00F16L2201/30G01M3/2853G01M3/3254H01L2924/0002H05K7/20272H01L2924/00
Inventor ISHIKURA, MITSUOTAMAYAMA, NOBUHIRO
Owner HITACHI LTD
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