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Refrigeration system with isentropic expansion nozzle

a technology of expansion nozzle and refrigerant, which is applied in the direction of refrigeration components, lighting and heating apparatus, domestic cooling apparatus, etc., can solve the problems of mechanical energy wasted in reducing the refrigerant pressure, and achieve the effect of minimizing the energy loss

Inactive Publication Date: 2014-07-31
HANON SYST
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

This patent describes a system that uses a special nozzle to decrease the pressure of refrigerant in a refrigeration system. This helps the refrigerant to flow more easily through the system, which makes it work more efficiently. The nozzle helps to minimize energy loss during the process.

Problems solved by technology

One problem with the throttling process involving the expansion valve is that mechanical energy is wasted in reducing the refrigerant pressure.

Method used

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  • Refrigeration system with isentropic expansion nozzle
  • Refrigeration system with isentropic expansion nozzle
  • Refrigeration system with isentropic expansion nozzle

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Embodiment Construction

[0020]The following description of technology is merely exemplary in nature of the subject matter, manufacture and use of one or more inventions, and is not intended to limit the scope, application, or uses of any specific invention claimed in this application or in such other applications as may be filed claiming priority to this application, or patents issuing therefrom. Regarding the methods disclosed, the order of the steps presented is exemplary in nature, and thus, the order of the steps can be different in various embodiments. Except in the examples, or where otherwise expressly indicated, all numerical quantities in this description are to be understood as modified by the word “about” in describing the broadest scope of the technology.

[0021]A non-limiting discussion of terms and phrases intended to aid understanding of the present technology is provided at the end of this Detailed Description.

[0022]The present technology includes refrigeration systems and methods of using su...

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PUM

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Abstract

A refrigeration system is provided that comprises a compressor, condenser, a thermal expansion valve, an isentropic expansion nozzle, and an evaporator. An isentropic expansion nozzle includes an inlet and an outlet with the isentropic expansion nozzle inlet fluidly coupled to a thermal expansion valve outlet. The evaporator includes an inlet and an outlet, wherein the evaporator inlet is fluidly coupled to the isentropic expansion nozzle outlet and the evaporator outlet is fluidly coupled to the compressor inlet. Using the system, a fluid can be modified prior to evaporation. The fluid is passed through the thermal expansion valve to decrease a pressure and decrease a temperature of the fluid. The fluid is then passed through the isentropic expansion nozzle to increase a velocity of the fluid without substantially changing the temperature of the fluid. The fluid is thereafter passed into the evaporator.

Description

FIELD OF THE INVENTION[0001]The present technology relates to using a thermal expansion valve coupled to an isentropic expansion nozzle to drop the pressure of a refrigerant and increase its flow velocity.BACKGROUND OF THE INVENTION[0002]This section provides background information related to the present disclosure which is not necessarily prior art.[0003]Heat transfer is useful for many purposes. For example, it is employed in refrigerators, air conditioning systems, vehicle HVAC systems, and the like, and can be used to liquefy gases for repeated distillation or rectification, or for storage in the liquified state. Heat transfer is further used in various devices that operate more efficiently at low temperatures. Such devices include, for example, superconductive electrical cables, cryogenic comminuting devices which embrittle a material before the milling thereof, among others. In addition, various heat transfer machines are employed to maintain materials at low temperatures to p...

Claims

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Application Information

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IPC IPC(8): F25B41/06F25B1/00
CPCF25B1/00F25B41/06F25B40/00
Inventor GOENKA, LAKHI NANDLAL
Owner HANON SYST