Power module package and method for fabricating the same

a technology of power module and power module, applied in the direction of semiconductor/solid-state device details, electrical apparatus, semiconductor devices, etc., can solve problems such as electronic parts generation problems, and achieve the effect of effectively removing heat generated by semiconductor devices

Inactive Publication Date: 2014-08-07
SAMSUNG ELECTRO MECHANICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

This configuration enhances heat radiation properties, prevents heat from affecting control devices, reduces module size and fabrication costs, and improves reliability by efficiently transferring heat from semiconductor devices, while maintaining insulation properties.

Problems solved by technology

For this reason, the solution to heat generation problem of electronic parts becomes an important issue.

Method used

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  • Power module package and method for fabricating the same
  • Power module package and method for fabricating the same
  • Power module package and method for fabricating the same

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Embodiment Construction

[0036]Various objects, advantages and features of the invention will become apparent from the following description of preferred embodiments with reference to the accompanying drawings.

[0037]The terms and words used in the present specification and claims should not be interpreted as being limited to typical meanings or dictionary definitions, but should be interpreted as having meanings and concepts relevant to the technical scope of the present invention based on the rule according to which an inventor can appropriately define the concept of the term to describe most appropriately the best method he or she knows for carrying out the invention.

[0038]The above and other objects, features and advantages of the present invention will be more clearly understood from the following detailed description taken in conjunction with the accompanying drawings. In the specification, in adding reference numerals to components throughout the drawings, it is to be noted that like reference numeral...

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Abstract

Disclosed herein are a power module package and a method for manufacturing the same. The power module package includes: first and second lead frames arranged to face each other, both or either of the first and second frames being made of aluminum; anodized layers formed on portions of the lead frame(s) made of aluminum in the first and second lead frames; and semiconductor devices mounted on first surfaces of the first and second lead frames.

Description

CROSS REFERENCE TO RELATED APPLICATION[0001]This application claims the benefit of Korean Patent Application No. 10-2011-0058468, filed on Jun. 16, 2011, entitled “Power Module Package and Method for[0002]Manufacturing the Same”, which is hereby incorporated by reference in its entirety into this application.BACKGROUND OF THE INVENTION[0003]1. Technical Field[0004]The present invention relates to a power module package and a method for fabricating the same.[0005]2. Description of the Related Art[0006]As energy usage increases over the world, a large interest has begun to focus on effective use of restricted energy. Accordingly, utilization of an inverter to which an intelligent power module (IPM) for efficient conversion used in the existing home or industrial products is applied is accelerating.[0007]As the application of this power module is expanding, high integration, high capacity and miniaturization are increasingly required by the market. For this reason, the solution to heat...

Claims

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Application Information

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Patent Type & AuthorityApplications(United States)
IPC IPC(8): H01L23/00
CPCH01L24/43H01L23/3107H01L23/49537H01L23/49568H01L23/49575H01L23/49586H01L24/48H01L2224/32245H01L2224/48137H01L2224/48247H01L2224/73265H01L2924/13055H01L2924/15724H01L2224/92247H01L2924/1305H01L2224/43H01L2924/00014H01L2924/181H01L2924/00H01L2224/45099H01L2224/05599H01L2924/00012H01L23/495H01L23/34
InventorKIM, KWANG SOOPARK, JI HYUNLEE, YOUNG KICHOI, SEONG MOON
OwnerSAMSUNG ELECTRO MECHANICS CO LTD