Chip assembling on adhesion layer or dielectric layer, extending beyond chip, on substrate

Abstract

Electronic module (100), which comprises a first substrate (102), a first dielectric layer (104) on the first substrate (102), at least one electronic chip (106), which is mounted with a first main surface (108) directly or indirectly on partial region of the first dielectric layer (104), a second substrate (110) over a second main surface (114) of the at least one electronic chip (106), and an electrical contacting (116) for the electric contact of the at least one electronic chip (106) through the first dielectric layer (104), wherein the first adhesion layer (104) on the first substrate (102) extends over an area, which exceeds the first main surface (108).

Description

BACKGROUND[0001]1. Field[0002]Various embodiments in general relate to an electronic module and method for producing of at least one electronic module.[0003]2. Description of the State of the Art[0004]Electronic modules can comprise one or more electronic chips which are for example encapsulated in an encapsulation structure and can be connected to an electronic periphery through electrically conductive contacts.[0005]It is also possible to produce an electronic module, while electronic chips are mounted between two metallic substrates and spaces are filled with prepreg material. In conventional processes of the type described, high temperatures can occur, which may negatively affect the electronic chips. Even a tilt-free mounting of electronic chips between two metallic substrates is a technological challenge.SUMMARY[0006]There might be a need for an electronic module which can be manufactured easily and be robust against errors.[0007]According to an exemplary embodiment, an electr...

AI Technical Summary

Benefits of technology

[0006]There might be a need for an electronic module which can be manufactured easily and be robust against errors.

Problems solved by technology

In conventional processes of the type described, high temperatures can occur, which may negatively affect the electronic chips.

Even a tilt-free mounting of electronic chips between two metallic substrates is a technological challenge.

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