Optical sensor device

Abstract

A package for an optical sensor device has a double molding structure in which a first resin molded portion (1) and a second resin molded portion (2) are subjected to contact fitting. The first resin molded portion (1) has a structure in which peripheries of a die pad portion (8) on which an optical sensor element (5) is mounted and a part of leads (3a, 3b) are molded with a resin so as to be integrated. The second resin molded portion (2) has a structure in which the periphery of the first resin molded portion (1) is molded with a resin so as to form an outer shape. When a cavity is formed, a glass substrate (4) having a filter function and an upper surface of the resin molded portions are bonded to each other to form a cavity structure.

Description

BACKGROUND OF THE INVENTION[0001]1. Field of the Invention[0002]The present invention relates to an optical sensor device. More specifically, the present invention relates to a package structure of the optical sensor device.[0003]2. Description of the Related Art[0004]FIG. 11 is a sectional view illustrating an example of a related-art package (FIG. 2 of Japanese Patent Application Laid-open No. 2002-198455). This package has the following structure. A package body 21 includes a lead 25 and a cavity formed by a bottomed portion 23 and an inner side surface 24 that are made of a resin material. A semiconductor element 22 is mounted on the bottomed portion 23 of the package body 21, and a lid 27 is provided on a package upper surface. A surface of a part of the lead 25 is exposed from the bottomed portion 23, and another part of the lead 25 is exposed to outside through the package formed of a resin molded portion so as to be used as an external terminal. An electrode is formed on a s...

AI Technical Summary

Benefits of technology

The present invention provides an optical sensor device with a hollow structure that has a cavity filled with a resin. This resin molding process removes stress applied to the optical sensor element, improves adhesion and airtightness between the die pad and lead, and achieves a strong holding force of the lead. The lead also acts as an external lead terminal and is bent and cut to alleviate mechanical stress. The resin molded portions hold the lead, and at least some of the mechanical stress can be received and alleviated by the resin. This prevents water and other substances from entering the package and improves reliability.

Problems solved by technology

In this structure, there are the following problems: the removal preventing force of the lead is low; the holding area thereof is small; and the lead surface made of a metal has low adhesion to the resin.

Further, in the case where the part of the lead 25 serving as the external lead terminal is bent and cut, mechanical stress is concentrated on a root portion between the molding resin and the lead 25 exposed to outside from the molding resin, so that the resin is liable to be peeled and cracked.

Further, a gap remains at an interface between the lead 25 and the resin, with the result that the package has low airtightness.

Therefore, it is difficult to obtain a strong holding force of the lead 25.

Further, there is also a problem in that water is liable to enter the package from outside, and in addition, ambient environment may change.

Thus, it becomes more difficult to obtain high reliability.

However, even in the structure in which the periphery of the lead 25 is sealed with the transparent mold resin 28 formed of an epoxy resin, the adhesion between the metal and the resin is not sufficient, and there is a significant difference in expansion coefficient between the metal and the resin.

In addition, there is a risk in that an external appearance of the package may be impaired.

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