Organic light emitting display apparatus

Abstract

An organic light-emitting display (OLED) device includes: a pixel area defined by a plurality of pixels on a flexible substrate; a non-pixel area around the pixel area; a gate driver in the non-pixel area; a structure in the non-pixel area configured to surround the pixel area; a first encapsulation layer covering the plurality of pixels, the gate driver and the structure; and a particle cover layer covering the pixel area and suppressed from being excessively spread by the structure.

Description

CROSS-REFERENCE TO RELATED APPLICATIONS[0001]This application claims the priority of Korean Patent Application No. 10-2014-0078438 filed on Jun. 25, 2014, Korean Patent Application No. 10-2014-0078252 filed on Jun. 25, 2014, Korean Patent Application No. 10-2014-0078748 filed on Jun. 26, 2014 and Korean Patent Application No. 10-2015-0088088 filed on Jun. 22, 2015 in the Korean Intellectual Property Office, which are all incorporated herein by reference.BACKGROUND OF THE INVENTION[0002]1. Field of the Invention[0003]The embodiments of the present disclosure relate to an organic light-emitting display (OLED) device, and more particularly to an OLED device capable of suppressing a particle cover layer from being excessively spread.[0004]2. Description of the Related Art[0005]As the era of information technology has unfolded, the field of display devices has been growing rapidly, as information can be represented in electrical signals in the form of visual images. In accordance with th...

AI Technical Summary

Benefits of technology

The patent text discusses the problem of using a flexible inorganic material to encapsulate FOLED devices, which can result in cracks due to foreign matter like dust or particles. These cracks can allow moisture to enter and cause defects in the FOLED. The patent proposes using a structure with subsidiary structures or metal structures to reduce these defects and improve production yield for mass production.

Problems solved by technology

Meanwhile, the inventors of the embodiments of the present disclosure have concluded that a glass substrate is not appropriate for an encapsulation unit since it is not flexible.

However, such a flexible encapsulation layer has poor flowability and is too thin to fully cover the foreign matter, and thus, cracks are easily made by the foreign matter such as dust or particles.

Therefore, moisture permeates through the cracks and causes defects in the FOLED.

As defects occur, production yield becomes lower, leading to a serious problem for implementing mass production.

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