Substrate processing apparatus, substrate processing system, and substrate processing method

Abstract

A top plate when located at a first position is held by an opposing-member holder, and the top plate when located at a second position is held by a substrate holder and rotated along with the substrate holder. In a substrate processing apparatus, a first processing liquid nozzle located at a supply position inside a to-be-held part of the top plate supplies a first processing liquid through an opposing-member opening to a substrate and is moved from the supply position to its retracted position, and a second processing liquid nozzle is moved from its retracted position to the supply position and supplies a second processing liquid through the opposing-member opening to the substrate. This configuration suppresses or prevents mixture of multiple types of processing liquids, as compared with the case where multiple types of processing liquids are sequentially supplied from a single processing liquid nozzle.

Description

TECHNICAL FIELD[0001]The present invention relates to a technique for processing a substrate.BACKGROUND ART[0002]A manufacturing process for manufacturing semiconductor substrates (hereinafter, simply referred to as “substrates”) conventionally involves various types of processing to be performed on the substrates. Examples of the processing include chemical processing such as processing for supplying a chemical solution onto a substrate that has a resist pattern on its surface to etch the surface of the substrate. The chemical processing is followed by cleaning processing for cleaning the substrate by supplying a cleaning solution to the substrate and dry processing for drying the substrate.[0003]For example, Japanese Patent Publication No. 3621568 (Document 1) discloses a substrate cleaning apparatus in which a lid member is placed on spin chunks that hold a wafer in a horizontal position and is rotated along with the wafer. When cleaning the substrate, a cleaning liquid is suppli...

AI Technical Summary

Benefits of technology

The present invention relates to a substrate processing apparatus for processing a substrate. The technical effects of the invention include: suppression of mixing of processing liquids, reduction of outside air entering the space between the opposing member and the substrate, holding of the opposing member in a simple configuration and moving it between a holding position and a retracted position, supplying a processing liquid to the substrate through the opposing-member opening, rotating the substrate along with the substrate holder about a central axis pointing in an up-down direction, and supplying an opposing-member holder with a simple configuration and allowing it to move between a holding position and a retracted position. These technical effects enable a substrate processing apparatus that can improve substrate processing efficiency and productivity while suppressing the entry of outside air.

Problems solved by technology

This may cause mixture of the cleaning liquid and deionized water in the nozzle.

Thus, there is an upper limit to the extent of a reduction in the oxygen concentration in the space between the lid member and the wafer.

This may complicate a configuration for holding the lid member.

As a result, residues of the cleaning liquid may be gradually accumulated on the lower surface of the lid member and become a source of pollution.

At this time, the substrate cleaning apparatus is unable to perform processing such as cleaning the substrate, and therefore, the productivity of the apparatus may be reduced.

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