Heat transfer device

Abstract

A heat transfer device configured to be independently fixed and densely mounted. The heat transfer device includes: a main body formed of a metallic material and forming a tube sealed to maintain a vacuum therein; and a thermally conductive layer having elasticity and adhered around the main body.

Description

REFERENCE TO RELATED APPLICATIONS[0001]This application claims the priority benefit of Korean Patent Application No. 10-2018-0016952 filed on Feb. 12, 2018, the entire contents of which are incorporated herein by reference.FIELD OF THE INVENTION[0002]The present invention relates to a heat transfer device, and more particularly, to a heat transfer device configured to be independently fixed and easily mounted in high density.BACKGROUND OF THE INVENTION[0003]In recent years, electronic components or modules have been highly integrated and designed to have high performance, and thus more heat is generated from such electronic components or modules. In addition, as the size of products decreases, heat is more densely generated. Therefore, measures for dissipating heat become more important.[0004]This situation is more noticeable in mobile terminals such as smartphones and tablets, and direct cooling or heat transfer is necessary to handle generated heat.[0005]Heat transfer devices such...

AI Technical Summary

Benefits of technology

The present invention is a heat transfer device that can transfer heat without the need for a thermally conductive adhesive material. It is also effective in transferring heat even when in contact with objects that are very hard.

Problems solved by technology

In addition, as the size of products decreases, heat is more densely generated.

Therefore, if a heat pipe has a complex shape such as a bent shape and a large length, it is difficult to manufacture double-sided adhesive tape according to the shape of the heat pipe, and it is more difficult to manufacture double-side adhesive tape having a small thickness or a long length according to the shape of an accommodation groove to install the heat pipe in the accommodation groove.

In addition, since double-sided adhesive tape is additionally used to fix such a heat pipe, it is inconvenient to densely mount the heat pipe, and additional costs are incurred.

In addition, since heat pipes are formed of a metallic material, the heat pipes may not be elastically brought into thermal contact with heat sources or metal cases for cooling, and thus it is difficult to transfer heat rapidly and reliably.

In particular, when a heat pipe formed of a metallic material is bought into contact with and coupled to a plurality of cooling metal fins, the effect of heat transfer is not satisfactory because of direct metal-to-metal contact.

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