Semiconductor device packages using a thermally enhanced conductive molding compound

Abstract

A heat transportation mechanism that is thermally conductive, but not electrically conductive, is provided so as to permit transportation of heat generated by a semiconductor device die to the exterior of a semiconductor device package. Embodiments can use a thermally conductive polymer structure, added to the package mold compound, to transport heat through the mold compound. The thermally conductive polymer structure can be fixed to the semiconductor device die prior to molding or can be included in an overmolding compound slug prior to performing the overmolding process. Flexibility of placement of the thermally conductive polymer structure is provided by using dielectric compounds.

Description

BACKGROUNDField[0001]This disclosure relates generally to semiconductor device packaging, and more specifically, to thermal management of packaged semiconductor device die.Related Art[0002]Semiconductor device die are often packaged in encapsulated packages formed around the device die using a molding compound, such as an epoxy or polymeric compound. This permits smaller, low cost packages and, through package substrates or lead frames, complex signal routing from the device die to external contacts.[0003]Thermal management issues arise when encapsulating higher power device die in molded packages. Typical encapsulation mold compounds do not conduct heat well and thus heat can get trapped near the device die. Since an excess of heat can damage semiconductor device die, thermal management techniques such as incorporating metal heat sinks and conduits are adopted. But due to their electrical conductive nature, the locations that such heat sinks and conduits can be utilized are limited...

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