Micro device and structure thereof

Abstract

A structure with micro device includes a substrate, at least one micro device, and at least one holding structure. The micro device includes an epitaxial structure and an overcoat layer. The epitaxial structure has a top surface and a bottom surface opposite to each other and a peripheral surface connecting the top surface and the bottom surface. The overcoat layer includes a contact portion and an extension portion. The contact portion covers the peripheral surface and the bottom surface of the epitaxial structure. The extension portion connects the contact portion and extends in a direction away from the peripheral surface. The holding structure includes at least one connecting portion, at least one sacrificial portion and at least one holding portion. The connecting portion is disposed on the top surface of the epitaxial structure and the extension portion of the overcoat layer. The sacrificial portion connects the connecting portion and the holding portion. A portion of the sacrificial portion contacts the extension portion to define a predetermined fracture region. The holding portion connects the sacrificial portion and extends onto the substrate.

Description

CROSS-REFERENCE TO RELATED APPLICATION[0001]This application claims the priority benefit of Taiwan patent application serial no. 108114271, filed on Apr. 24, 2019. The entirety of the above-mentioned patent application is hereby incorporated by reference herein and made a part of specification.BACKGROUNDField of the Disclosure[0002]This disclosure relates to a semiconductor structure, and more particularly to a micro device and a structure thereof.Description of Related Art[0003]At present, the transfer of the micro LEDs is to transfer the micro LEDs on a temporary substrate to a receiving substrate mainly through electrostatic force or magnetic force. In general, the micro LEDs are held through a holding structure, such that the micro LEDs are easily picked up from the temporary substrate, transported and transferred to the receiving substrate. Meanwhile, the holding structure is used to secure the micro LEDs so the quality of the micro LEDs is not affected due to other external fa...

AI Technical Summary

Benefits of technology

The patent describes a structure with a micro device that can be transferred without leaving any part of the original holding structure on the surface. The transfer is made possible by a predetermined fracture region defined by the sacrificial portion of the holding structure and the extension portion of the overcoat layer. This results in improved light-emitting efficiency and a better overall effect of the micro device.

Problems solved by technology

However, since the area of the contact surface between the holding structure and the peripheral surface of the micro LED cannot be controlled easily, there is residual holding structure remained on the peripheral surface of the micro LED after the transfer, which affects light emission of the transferred micro LED.

In view of the above, it has been one of the important issues in the industry to find out how to prevent the holding structure from remaining on the peripheral surface of the micro LED when transporting and transferring the micro LED.

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