Power supply apparatus
a power supply and power supply technology, applied in the direction of power supply for data processing, instruments, measurement devices, etc., can solve the problems of insufficient utilization of space above the main board power supply, increase in space occupied and power consumption, and high manufacturing cost, and achieve stable conduction, good conduction performance, and high power density
Inactive Publication Date: 2021-03-18
DELTA ELECTRONICS INC
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Benefits of technology
The present invention provides a solution for both power pressure and efficiency in application settings requiring a larger horizontal area, such as data centers. A stack structure allows for proper utilization of power supply height, while reducing floor space. The invention also includes a power module and manufacturing method with improved conduction performance and reduced manufacturing costs. The technical effects include increased efficiency, improved performance, and reduced losses or breaking of leading wires.
Problems solved by technology
With the improvement of the processing capability of the server unit volume, the numbers of these chips and the integration level thereof are also increased, which results in the increase of the space occupied and the power consumption.
For example, for a server with a height of 1U (about 40 mm; the actual size of the 1U device may vary due to the fit tolerance), the main board is a PCB consisting of 6 to 50 layers, which is very expensive to manufacture.
In this way, the space above the main board power supply is not adequately utilized.
Yet, since the components are individually installed, there should be necessary space or safety distance between components, thereby limiting the further size reduction of the horizontal area; also, the uneven height would affect the subsequent handling of the heat.
Therefore, this solution is only one of the solutions for pursuing a better power density; however, it cannot adequately address the improvement regarding the power pressure of the main board power supply.
Method used
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[0043]The present disclosure will now be described more specifically with reference to the following embodiments. It is to be noted that the following descriptions of preferred embodiments of this disclosure are presented herein for purpose of illustration and description only. It is not intended to be exhaustive or to be limited to the precise form disclosed.
[0044]In the following detailed description, for purposes of explanation, numerous specific details are set forth in order to attain a thorough understanding of the disclosed embodiments. In accordance with common practice, like reference numerals and designations in the various drawings are used to indicate like elements / parts. Moreover, well-known elements or method steps are schematically shown or omitted in order to simplify the drawing and to avoid unnecessary limitation to the claimed invention.
[0045]In the detailed description and appended claims, the term “coupled with” applies generally to that one component is indirec...
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Disclosed herein is a power supply apparatus that includes a bearing plate, insulation material and a plurality of pins. The insulation material is formed on two opposite surfaces of the bearing plate. The plurality of pins are electrically connected to the bearing plate and allocated along lateral sides of the insulation material.
Description
CROSS-REFERENCE TO RELATED APPLICATION[0001]This application is a continuation-in-part application of U.S. application Ser. No. 15 / 952,224 filed on Apr. 12, 2018, and entitled “POWER SUPPLY APPARATUS”, which is a divisional application of U.S. application Ser. No. 14 / 840,063 filed on Aug. 31, 2015, and entitled “POWER SUPPLY APPARATUS”. The entire contents of the above-mentioned patent applications are incorporated herein by reference for all purposes.FIELD OF THE INVENTION[0002]The present invention relates to a power supply apparatus. More particularly, the present invention relates to the internal structure of a power supply apparatus.BACKGROUND OF THE INVENTION[0003]With people's increased demand to the intelligent life, the society's need to data processing is also growing. The global energy consumption spent on data processing averages thousands or even tens of thousands kilowatt-hour (KWH); and a large scale data center may occupy tens of thousands square meters. Therefore, a...
Claims
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IPC IPC(8): G06F1/26G06F1/20
CPCG06F1/26G06F1/20G06F1/263
Inventor WANG, TAOZHOU, MINZHANG, YULIANGZENG, JIANHONG
Owner DELTA ELECTRONICS INC