Methods of fabricating crossbar array microelectronic electrochemical cells

Abstract

The present invention provides microelectronic electrochemical structures and related fabrication methods. A composite microelectronic structure is provided that includes first and second conductors dielectrically isolated from one another at a crossing thereof, the crossing surrounded by a dielectric material. A portion of the dielectric material around the crossing of the first and second conductors is removed to form a well that exposes respective outer surfaces of the first and second conductors and a molecule is deposited in the well such that the deposited molecule contacts the exposed outer surfaces of the first and second conductors.

Description

RELATED APPLICATION[0001]This application is related to and claims priority from U.S. Provisional Application Ser. No. 60 / 433,923, filed Dec. 17, 2002, entitled Crossbar Array Microelectronic Electrochemical Cells and Fabrication Methods Therefor, the disclosure of which is hereby incorporated herein by reference as if set forth in its entirety.FIELD OF THE INVENTION[0002]The present invention relates to microelectronic devices and, more particularly, to microelectronic electrochemical devices and fabrication methods therefor.BACKGROUND OF THE INVENTION[0003]Recently, there has been a great interest in the field of molecular electronics. The potential for molecular memory devices has been studied where charge storage can be used to read and / or write data. Detailed information with respect to this topic can be found in the following publications: Harell, S. et al., Microelectron Eng., 30, 11 (1996); Reed, M. A. et al., Since, Volume 278, 252-254 (1997); Reed, M. A., Proc. IEEE, Volum...

AI Technical Summary

Problems solved by technology

This fabrication process may cause the molecules located in the gap between the first and second set of metal lines to be damaged or destroyed during the deposition and patterning of the second set of metal lines.

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