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Voltage converter module

a voltage converter and module technology, applied in the direction of process and machine control, electronic components association, instruments, etc., can solve the problem of limiting the noise-removing ability of capacitors to make full use of noise-removing ability, and achieve the effect of excellent noise-removing ability

Inactive Publication Date: 2006-01-10
PANASONIC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

"The present invention provides a compact and low-profile voltage converter module that closely places the voltage converter IC and capacitors in three dimensions to make the most of its noise-removing ability. The module includes a first connecting layer, first inner wiring layer, component built-in layer, second inner wiring layer, second connecting layer, capacitor-mounted layer, and components. The module has a circuit that connects the first and second capacitors, and a terminal of the voltage converter IC is electrically coupled to terminals of peripheral components through the second inner wiring layer. The module is excellent in removing noises and is suitable for use in a compact and low-profile design."

Problems solved by technology

Therefore, this place problem limits those capacitors to make full use of their noise-removing ability, which should have been effective if they had been placed immediately close to the voltage converter IC.

Method used

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exemplary embodiment 1

[0038]FIG. 1 shows a sectional view illustrating a structure of a voltage converter module in accordance with the first exemplary embodiment of the present invention. FIG. 2 is a circuit diagram of the voltage converter module. In FIGS. 1 and 2, voltage converter IC 11 converts a voltage. First capacitor 16 is coupled between input terminal 14 of IC 11 and the grounding. Second capacitor 17 is coupled between output terminal 15 and the grounding. First and second capacitors 16, 17 are used for removing noises.

[0039]Terminal surface 2 is placed at the lowest position of voltage converter module 50 and includes connecting terminals 1 for coupling to an external signal.

[0040]Terminals placed on terminal surface 2 are electrically coupled to wiring pattern 73 formed on first inner wiring layer 4 through via-hole conductor 3. Meanwhile the via-hole conductor formed on first connecting layer is called a first via-hole conductor.

[0041]Voltage converter IC 11 is integrated in component buil...

exemplary embodiment 2

[0060]FIG. 6 shows a sectional view illustrating a structure of a voltage converter module in accordance with the second exemplary embodiment of the present invention. FIG. 7 shows the circuit diagram of the module.

[0061]In FIGS. 6 and 7, between input terminal 14 inputting a signal to voltage converter IC 11 and the grounding, first capacitor 16 is coupled for removing noises. Inductor 22 is coupled in series between output terminal 15 and the output terminal of voltage converter IC 11. Between output terminal 15 and the grounding, second capacitor 17 is coupled. Inductor 22 and second capacitor 17 form a smoothing circuit.

[0062]Terminal surface 2 is placed at the lowest position of module 50, and includes connecting terminal 1 for communicating signals to / from an external circuit.

[0063]A terminal prepared on terminal surface 2 is electrically coupled to wiring pattern 73 formed on first inner wiring layer 4 through first via-hole conductor 3 formed in first connecting layer 7.

[006...

exemplary embodiment 3

[0082]FIG. 8 shows a sectional view illustrating a structure of a voltage converter module in accordance with the third exemplary embodiment of the present invention. FIG. 7 shows the circuit diagram of the module, namely, the third embodiment uses the same circuit as that of the second embodiment.

[0083]In order to obtain DC superposition characteristics and a high inductor value, smoothing inductor 22 is formed of a coil and magnetic material such as a ferrite core.

[0084]A coil shown in FIG. 8 is constructed as follows: Helical line 31 is included in a layer disposed over at least one of first connecting layer 7, component built-in layer 8 and second connecting layer 9. Helical spiral line 31 is, for instance, constructed as follows: a spiral-coil pattern made of conductor is formed on an insulating resin layer. This pattern is coupled to another spiral-coil pattern formed in the next layer through the via-hole conductor formed in the insulating resin layer such that they form a co...

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PUM

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Abstract

A voltage converter module is formed by multi-layering a first connecting layer, a first inner wiring layer, a component built-in layer, a second inner wiring layer, a second connecting layer, and a capacitor-mounted layer, and a capacitor built-in layer with resin composite. A connecting terminal formed on a terminal surface of the first connecting layer, the first inner wiring layer, the second inner wiring layer and the capacitor-mounted layer are electrically coupled to each other through via-hole conductors. The second inner wiring layer couples a voltage converter IC to peripheral components, both being incorporated in the component built-in layer. A first capacitor and a second capacitor incorporated in the capacitor built-in layer are mounted to the capacitor-mounted layer. This structure forms a circuit, in which the first capacitor is coupled to the second capacitor, between the voltage converter IC and the grounding.

Description

TECHNICAL FIELD[0001]The present invention relates to a voltage conversion module to be used in information communication devices and mobile communication devices.BACKGROUND ART[0002]FIG. 11 shows a conventional voltage converter circuit. In FIG. 11, voltage converter IC 143, capacitor 141 and capacitor 142 are placed on a layer, namely, they are placed in two dimensions. Voltage converter IC 143 converts a voltage, and each one of capacitors 141, 142 has a capacity of not less than 1 μF and are coupled between IC 143 and the grounding, thereby removing noises.[0003]Since capacitors 141 and 142 have a capacity of not less than 1 μF, they are large in dimensions, so that the layout of IC 143, capacitor 141 and capacitor 142 is restricted when they are mounted in the two dimensions. Therefore, this place problem limits those capacitors to make full use of their noise-removing ability, which should have been effective if they had been placed immediately close to the voltage converter I...

Claims

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Application Information

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Patent Type & Authority Patents(United States)
IPC IPC(8): H05K7/06H01L23/52H05K3/46H01L23/538H01L25/16H02M3/00H05K1/18
CPCH01L23/5389H01L25/162H01L25/165H05K1/185H05K2201/1003H01L2924/19105H05K2201/10015H05K2201/10022H01L2224/16
Inventor HIGASHITANI, HIROSHIHAYAMA, MASAAKIMIDO, YUJI
Owner PANASONIC CORP