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Thin-film magnetic head

a thin-film magnetic head and magnetic head technology, applied in the field can solve problems such as fluctuation of thin-film magnetic heads, and achieve the effects of reducing cracks, improving coating ratio, and keeping performances from fluctuating

Inactive Publication Date: 2011-05-24
TDK CORPARATION
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The present invention provides a thin-film magnetic head that can keep performances from fluctuating while restraining an organic insulating material from peeling off. The technical effect of the invention is achieved by interposing an organic insulating material between turns adjacent to each other in the lead constituting the thin-film coil, and forming an uncoated area free of the organic insulating material on the upper face of the maximum width part of the lead in the laminating direction. This prevents cracks from occurring and ensures a stable performance of the thin-film magnetic head.

Problems solved by technology

This affects characteristics of the thin-film coil very much, which is problematic in that performances of thin-film magnetic heads fluctuate among products.

Method used

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Examples

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example 1

[0085]The present invention will now be explained more specifically with reference to Examples 1-1 to 1-9 and Comparative Examples 1-1 and 1-2 and FIG. 11, but is not restricted to the following examples. FIG. 11 is a table showing embodied conditions and evaluation results of Examples 1-1 to 1-9 and Comparative Examples 1-1 and 1-2.

example 1-1

[0086]On a substrate made of Al2O3.TiC, Al2O3 was laminated as an undercoat layer, so as to form the support 10. Then, according to the above-mentioned method of manufacturing the thin-film magnetic head 1, the reading head part 20, the insulating layer 30, the recording head part 40, the resist films 56, 60, and the insulating layers 50, 52 were formed, so as to yield the thin-film magnetic head 1. In the thin-film magnetic head 1 of Example 1-1, the lead width Wmin of the minimum width part 46a as seen from the upper part in the laminating direction was set to 1.9 μm, while the lead width Wmax of the maximum width part 46b as seen from the upper part in the laminating direction was set to 5.0 μm. Also, in the thin-film magnetic head 1 of Example 1-1, the thickness tC of the maximum width part 46b in the laminating direction was set to 2.0 μm, while the thickness tR of the resist film 56 in the laminating direction was set to 2.5 μm, so that the ratio tC / tR of the thickness tC of t...

examples 1-2 to 1-9

[0089]The thin-film magnetic heads 1 of Examples 1-2 to 1-9 were obtained as in Example 1-1 except that X was set to 0.2, 0.3, 0.4, 0.5, 0.6, 0.7, 0.8, and 0.9, respectively.

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Abstract

The thin-film magnetic head comprises a lower magnetic pole layer, an upper magnetic pole layer and a first thin-film coil. A resist film made of an organic insulating material is interposed between turns adjacent to each other in the lead constituting the first thin-film coil. The first thin-film coil has a minimum width part and a maximum width part. The minimum width part is arranged closer to an air bearing surface than is a second upper magnetic pole part, while the whole upper face of the minimum width part is covered with the resist film. The maximum width part is arranged on the side farther from the air bearing surface than is the second upper magnetic pole part, while the upper face of the maximum width part is formed with a resist-uncoated area free of the resist film.

Description

BACKGROUND OF THE INVENTION[0001]1. Field of the Invention[0002]The present invention relates to a thin-film magnetic head.[0003]2. Related Background Art[0004]A thin-film magnetic head in which the whole upper face of a lead constituting a thin-film coil is covered with an organic insulating material has conventionally been known (see, for example, Japanese Patent Application Laid-Open No. 2000-268321).[0005]Also, a thin-film magnetic head in which an organic insulating material is interposed between turns adjacent to each other in a lead constituting a thin-film coil, while an inorganic insulating material is in contact with the upper and lower faces of the lead in the laminating direction has conventionally been known (see, for example, Japanese Patent Application Laid-Open No. 2004-134039).SUMMARY OF THE INVENTION[0006]A thermal load or the like in a later step generates a stress in the organic insulating material, whereas the magnitude of the stress is in proportion to the volu...

Claims

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Application Information

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Patent Type & Authority Patents(United States)
IPC IPC(8): G11B5/17G11B5/31
CPCG11B5/3123
Inventor HIRAKI, TETSUYAGOMI, HIROTAKAMAEJIMA, KAZUHIKO
Owner TDK CORPARATION
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