Method of manufacturing printed circuit board
a manufacturing method and printed circuit board technology, applied in the field of printed circuit board manufacturing, can solve the problems of generating various problems, unable to form the via hole with a desired shape, and affecting the realization of structural effects, and achieves the effect of high design freedom and easy processing of holes
Active Publication Date: 2011-07-05
SAMSUNG ELECTRO MECHANICS CO LTD
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Benefits of technology
This method enables efficient processing of via holes with high design freedom and reduced energy consumption, facilitating the formation of reliable electrical connections between layers in printed circuit boards.
Problems solved by technology
For example, in case that a related structure in which a circuit pattern is formed on a surface of an insulation body is applied to a high density circuit (e.g. 20 / 20 um or less), various problems are generated.
On the other hand, in accordance with the aforementioned related art, there are various problems.
For example, in the operation of processing a via hole by using a laser drill to form a via for connecting a layer to another layer, using energy excessively makes it impossible to form the via hole with a desired shape.
These problems are regarded as hindrance to realizing the structural benefits, which were expected to be implemented through the structure of a circuit pattern buried in an insulation body.
Method used
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[0018]Since there can be a variety of permutations and embodiments of the present invention, certain embodiments will be illustrated and described with reference to the accompanying drawings. This, however, is by no means to restrict the present invention to certain embodiments, and shall be construed as including all permutations, equivalents and substitutes covered by the spirit and scope of the present invention. Throughout the drawings, similar elements are given similar reference numerals. Throughout the description of the present invention, when describing a certain technology is determined to evade the point of the present invention, the pertinent detailed description will be omitted.
[0019]Terms such as “first” and “second” can be used in describing various elements, but the above elements shall not be restricted to the above terms. The above terms are used only to distinguish one element from the other.
[0020]The terms used in the description are intended to describe certain ...
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Abstract
Disclosed is a method of manufacturing a printed circuit board. The method of manufacturing a printed circuit board having a via for connecting one layer to another layer can include forming a circuit pattern on one surface of a carrier; processing a hole corresponding to the via on one surface of the carrier; compressing the surface of the carrier into one surface of an insulation body; removing the carrier; processing a via hole on the insulation body, corresponding to a position of the hole; and forming a conductive material in the via hole, to thereby easily process a hole for forming a via and have high design freedom.
Description
CROSS-REFERENCE TO RELATED APPLICATIONS[0001]This application claims the benefit of Korean Patent Application No. 10-2008-0071153, filed with the Korean Intellectual Property Office on Jul. 22, 2008, the disclosure of which is incorporated herein by reference in its entirety.BACKGROUND[0002]1. Technical Field[0003]The present invention relates to a method of manufacturing a printed circuit board.[0004]2. Description of the Related Art[0005]With the development of the electronics industry, there has been a radically growing demand for smaller electronic parts with more advanced functions. Such a trend requires that circuit patterns are implemented in a printed circuit board in high density, and accordingly the method of forming micro circuit patterns is being developed and suggested in various ways.[0006]For example, in case that a related structure in which a circuit pattern is formed on a surface of an insulation body is applied to a high density circuit (e.g. 20 / 20 um or less), va...
Claims
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IPC IPC(8): B32B37/02H05K1/02H01L21/70
CPCB32B38/04H05K3/428H05K3/4652Y10T156/1064B32B2038/0092B32B2038/047B32B2309/105B32B2310/0843B32B2457/08H05K3/0035H05K3/108H05K3/421H05K2201/0376H05K2203/0384H05K2203/0554Y10T156/1056Y10T156/1082Y10T156/1057B32B38/10H05K3/40H05K3/42
Inventor KANG, MYUNG-SAMPARK, JUNG-HYUNPARK, JEONG-WOOKIM, JI-EUN
Owner SAMSUNG ELECTRO MECHANICS CO LTD