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LED lamp assembly

a technology of led lamps and assembly parts, which is applied in the direction of lighting and heating apparatus, semiconductor devices for light sources, and light support devices, etc., can solve the problems of lowering heat dissipation performance and high defective rate, and achieve the effect of simple structure and easy assembly

Active Publication Date: 2015-09-01
HUANG TSUNG HSIEN
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The present invention provides an LED lamp assembly that has a simple structure and can be easily assembled using a stamping technique. The radiation fin set has a stepped structure at the top side with a plug portion located at a middle part of the stepped structure. Each radiation fin also has a horizontal protruding portion located at the stepped structure and abutted against an inner side of the associated folded plug portion at a relatively lower elevation. The horizontal protruding portions of the radiation fins are respectively horizontally abutted against one another, forming an annular plane that is closely attached to the flat inner wall of the heat-sink base for rapid transfer of waste heat for quick dissipation into the outside open air.

Problems solved by technology

However, after the radiation fin set and the flat heat-sink base are assembled, the folded flanges of the radiation fins may not be closely attached to the surface of the flat heat-sink base for quick transfer of waste heat, thus lowering the heat dissipation performance.
The fabrication difficulty is likely to cause a high defective rate.

Method used

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Examples

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Embodiment Construction

[0024]Referring to FIGS. 1 and 2, a LED lamp assembly in accordance with a first embodiment of the present invention is shown. The LED lamp assembly comprises a radiation fin set 10, a heat-sink base 2, an insulative connector 3, and a lampshade 4 fastened to a top open side of the radiation fin set 10.

[0025]The radiation fin set 10 comprises a plurality of radiation fins 1. Each radiation fin 1 defines a plug portion 11 at the top side thereof.

[0026]The heat-sink base 2 is a flat metal block member, comprising opposite flat inner wall 2a and outer wall 2b, a plurality of insertion notches 21 equiangularly and radially located at the flat inner wall 2a (see FIG. 3), a light-emitting unit formed of a series of LED devices (not shown) and mounted at the flat outer wall 2b, and a plurality of through holes 22; 23 cut through the opposing inner wall 2a and outer wall 2b for the passing of electrical wires (not shown) of the LED devices.

[0027]The insulative connector 3 is adapted to hold...

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Abstract

An LED lamp assembly includes a heat-sink base having insertion notches equiangularly and radially located at a flat inner wall thereof, and a plurality of radiation fins arranged in a radial array, each radiation fin having a plug portion disposed at a top side thereof and respectively inserted into one respective insertion notch of the heat-sink base and fixedly secured thereto using a stamping technique, a lampshade fastened to the radiation fins at the top side, and an insulative connector fastened to the radiation fins at the bottom side.

Description

BACKGROUND OF THE INVENTION[0001](a) Field of the Invention[0002]The present invention relates to LED lamp technology and more particularly to a LED lamp assembly, which comprises a heat-sink base holding a series of LED devices, and a set of radiation fins arranged in a radial array and fastened to a flat inner wall of the heat-sink base using a stamping technique.[0003](b) Description of the Prior Art[0004]A conventional LED lamp assembly is comprises a radiation fin set, a heat-sink base, an insulative connector, LED devices, and a lampshade. Taiwan Utility Nos. M389826 and M419035 teach a way of connection between a radiation fin set and a heat-sink base. According to these two prior art designs, radiation fins are mounted around a tubular heat-sink base that holds a series of LED devices. During the operation of the LED devices, waste heat is transferred from the LED devices through the tubular heat-sink base to the radiation fins for dissipation into the outside open air.[0005...

Claims

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Application Information

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Patent Type & Authority Patents(United States)
IPC IPC(8): F21V29/00F21V17/16F21K99/00F21V29/77F21V3/00F21Y101/02
CPCF21V17/16F21K9/135F21V29/773F21V3/00F21Y2101/02Y10T29/49002F21K9/232F21Y2115/10F21V29/74F21K9/237F21V17/10
Inventor HUANG, TSUNG-HSIEN
Owner HUANG TSUNG HSIEN