Communication connector and transmission wafer thereof

a technology of communication connectors and transmission wafers, applied in the direction of coupling device connections, coupling protective earth/shielding arrangements, two-part coupling devices, etc., can solve problems such as complex manufacturing, and achieve the effect of easy production

Active Publication Date: 2015-10-13
SUZHOU CHIEF HSIN ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0006]One embodiment of the instant disclosure provides a communication connector and a transmission wafer thereof, which are produced easily without affecting the signal transmission effect.

Problems solved by technology

Each communication connector has a plurality of conductive terminals, and the manufacturing complexity of each the communication connector is related to the construction and the relative position design of the conductive terminals.

Method used

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  • Communication connector and transmission wafer thereof
  • Communication connector and transmission wafer thereof
  • Communication connector and transmission wafer thereof

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Embodiment Construction

[0023]Please refer to FIGS. 1 and 2, which show an embodiment of the instant disclosure. The aforementioned illustrations and following detailed descriptions are exemplary for the purpose of further explaining the scope of the instant disclosure. Other objectives and advantages related to the instant disclosure will be illustrated in the subsequent descriptions and appended drawings. In the drawings, the size and relative sizes of layers and regions may be exaggerated for clarity.

[0024]The instant embodiment provides a communication connector 100 for perpendicularly installing on a circuit board (not shown), such as a vertical communication connector, and the figures of the instant embodiment takes a mini SAS HD connector applied to high frequency communication for example, but the type of the communication connector 100 is not limited thereto. The communication connector 100 includes an outer casing 1 and a plurality of transmission modules 2 inserted into the outer casing 1. The f...

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PUM

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Abstract

A communication connector includes an outer casing and a plurality of transmission wafers inserted into the outer casing. The transmission wafers are provided for receiving a mating connector along an inserting direction. Each communication wafer includes at least two terminals in coplanar arrangement, and each terminal has a straight segment. The straight segments of the terminals are respectively arranged in a first acute angle and a second acute angle with respective to the inserting direction, in which the first acute angle is smaller than the second acute angle. Two virtual lines, which are respectively defined by extending from the straight segments along the longitudinal directions thereof, are intersecting to form an angle. The angle is the difference of the first and second acute angles. Thus, the communication connector provided by the instant disclosure is produced easily.

Description

BACKGROUND OF THE DISCLOSURE[0001]1. Field of the Disclosure[0002]The instant disclosure relates to an electrical connector; more particular, to a communication connector and a transmission wafer thereof.[0003]2. Description of Related Art[0004]The conventional communication connecting device includes two communication connectors for transmitting signal by inserting to each other. Each communication connector has a plurality of conductive terminals, and the manufacturing complexity of each the communication connector is related to the construction and the relative position design of the conductive terminals. Thus, how to manufacture the conductive terminals more easily without affecting the signal transmission effect by changing the construction and the relative position design thereof has become one of the main research directions in the connector field.[0005]To achieve the abovementioned improvement, the inventors strive through industrial experience and academic research to prese...

Claims

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Application Information

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Patent Type & Authority Patents(United States)
IPC IPC(8): H01R13/648H01R24/66H01R12/71H01R13/658
CPCH01R24/66H01R13/65802H01R12/716H01R13/518H01R13/6473H01R13/658
Inventor PAO, CHUNG-NANWANG, WEICHOU, SUN-YU
Owner SUZHOU CHIEF HSIN ELECTRONICS CO LTD
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