Microelectro-mechanical systems (MEMS) microphone package device and MEMS packaging method thereof

a micro-electro-mechanical system and microphone technology, applied in the direction of solid-state device transducers, loudspeakers, electrostatic transducers of semiconductor, etc., can solve the problem of relatively large volume of the package, and achieve the effect of small volum

Active Publication Date: 2016-02-23
SOLID STATE SYST
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0008]The invention provides a MEMS microphone package device and the MEMS packaging method, the package structure can at least be in smaller volume and be a single chip.

Problems solved by technology

Further the package size is relatively large.

Method used

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  • Microelectro-mechanical systems (MEMS) microphone package device and MEMS packaging method thereof
  • Microelectro-mechanical systems (MEMS) microphone package device and MEMS packaging method thereof
  • Microelectro-mechanical systems (MEMS) microphone package device and MEMS packaging method thereof

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Embodiment Construction

[0023]In the invention, the Silicon MEMS microphone chip has the integrated circuit embedded in the same chip. The Silicon MEMS microphone chip in package is a single ship. The Silicon MEMS microphone chip can be adhered to the substrate by the adhesive structure for form a fully sealed space except the acoustic aperture to receive the acoustic source from the environment.

[0024]Several embodiments are provided for descriptions of the invention. However, the invention is not just limited to the provided embodiments.

[0025]FIG. 3 is a drawing, schematically a cross-section view of a MEMS microphone package device, according to an embodiment of the invention. In FIG. 3, a MEMS microphone package device 120 includes a substrate 100 as a base. The substrate 100 has interconnection structure 104, which has multiple connection pads 104, such as metal pad, on both surfaces of the substrate. In FIG. 3, only one connection pad is shown. However, it can be understood that the interconnection st...

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PUM

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Abstract

A MEMS microphone package device includes a MEMS microphone chip as an integrated circuit chip. An acoustic sensing structure is embedded in the integrated circuit chip. An adhesive structure adheres on outer sidewall of the microphone chip. A bottom portion of the adhesive structure protrudes out from first surface of the microphone chip and adheres on a surface of a substrate, having interconnection structure, to form a first seal ring. A space between the acoustic sensing structure and the substrate and sealed by the first seal ring forms a second chamber. A cover adheres to top portion of the adhesive structure, covering over the cavity on the second surface of the microphone chip. The top portion of the adhesive structure forms as a second seal ring. A space between the cover and the second surface of the microphone chip and sealed by the second seal ring forms a first chamber.

Description

BACKGROUND[0001]1. Field of Invention[0002]The present invention relates to MEMS microphone package device and MEMS packaging method.[0003]2. Description of Related Art[0004]The Silicon MEMS microphone chip, such as MEMS microphone, has been proposed to form a microphone with rather reduced volume and then can be easily implemented into the large system.[0005]FIG. 1 is a drawing, schematically illustrating a conventional MEMS microphone after packaging. In FIG. 1, a Silicon MEMS microphone chip 52 and an integrated circuit chip 56 are implemented on the substrate 50 with proper wire bonding. The substrate functions as a circuit board for communicating between the Silicon MEMS microphone chip 52 and the integrated circuit chip 56. The Silicon MEMS microphone chip 52 can sense an acoustic source received from an acoustic aperture 62 of a cap 58 and convert the acoustic source into electric signal. In order to process the sensing signal, the integrated circuit chip 56 receives the sens...

Claims

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Application Information

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Patent Type & Authority Patents(United States)
IPC IPC(8): H04R25/00H04R23/00H04R31/00H04R19/00H04R19/04
CPCH04R19/005H04R19/04H04R23/006H04R23/00H04R31/00H04R2201/003
Inventor HSIEH, TSUNG-MINLEE, CHIEN-HSINGCHUNG, CHIH-HSIENCHEN, YONG-WEILIOU, JHYY-CHENG
Owner SOLID STATE SYST
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