Method for sticking an insulating film to a lead frame
a technology of insulating film and lead frame, which is applied in the directions of chemistry apparatus and processes, transportation and packaging, packaging, etc., can solve the problems of deformation of the edge of the punch, large pressing force of the punch on the lead frame, and deformation of the insulating film
Inactive Publication Date: 2001-08-14
HITACHI CABLE
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- Abstract
- Description
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- Application Information
AI Technical Summary
Benefits of technology
Accordingly, it is an object of the invention to provide a method and an apparatus for sticking an insulating film to a lead frame in which the influence of thermal expansion of a punch is eliminated.
Problems solved by technology
In the conventional method for sticking an insulating film to a lead frame, however, there is a disadvantage in that an insulating film is not properly punched to result in deformed edges (burrs and chips) on a punched insulating film, when the punch has a length greater than 13 mm to arise the remarkable influence on a clearance between the punch and the die due to the thermal expansion of the punch.
Further, there is a disadvantage in that a pressing force of the punch on the lead frame is large to deform the punched insulating film, and, in a rare case, the lead frame, as described in detail later.
Method used
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Embodiment Construction
Before explaining a method and an apparatus for sticking an insulating film to a lead frame in the preferred embodiments according to the invention, the aforementioned conventional method for sticking an insulating film to a lead frame will be again explained.
FIG. 1 shows an apparatus to be used for the conventional method for sticking an insulating film to a lead frame. The apparatus comprises a die 2 for placing an insulating film 4 thereon, punches 5 for punching the insulating film 4 and adsorbing punched insulating films 4 on the tip plane by vacuum, a punch guide 3 for guiding the punches 5 through guide apertures thereof, a heater 6 for heating a lead frame 1 placed thereon to be a predetermined temperature, a punch holder 51 for holding the punches 5, a shank 52 for vertically moving the punches 5 up and down, and a cylinder 53 for generating a moving force to be applied to the sank 52. In some use, a spacer 54 may be provided.
In operation, the insulating film 4 is transferr...
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Abstract
A method for punching an insulating film is composed of using plural divided punches having a clearance between each two of the divided punches. The clearance absorbs thermal expansion of the divided punches caused by receiving a heat from a heater. A punched insulating film is stuck to a lead frame by being pressed between the divided punches and the heater.
Description
FIELD OF THE INVENTIONThe invention relates to a method and an apparatus for sticking an insulating film to a lead frame, and more particularly, to insulating film sticking method and apparatus by which an insulating film is adhesively attached on an inner lead portion of a lead frame by stable sticking characteristics.BACKGROUND OF THE INVENTIONIn accordance with the development of high density mounting technology for LSIs, the number of input and output pins is increased relative to an area of semiconductor chips, so that the number of the semiconductor chips mounted on a circuit board is decreased, and the size of the circuit board is made small. Thus, the high density mounting of LSIs is realized by using a mounting method of, for instance, the lead type or the surface mounting type.A conventional semiconductor package using a method of "LOC(Lead On Chip)" fabricated by the high density mounting technology comprises a semiconductor chip having electrodes thereon, and a lead fram...
Claims
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Patent Timeline
Login to View More IPC IPC(8): H01L21/48H01L21/00H01L23/48H01L23/495H01L21/02
CPCH01L21/4839H01L23/4951H01L23/49558H01L21/67144Y10T156/1326H01L2224/48091H01L2224/48247H01L2224/73215Y10T156/107H01L2224/4826H01L2224/32245H01L24/48H01L2924/00014H01L2924/00012Y10T83/04Y10T83/06Y10T83/9423H01L2224/45099H01L2224/05599H01L21/52
Inventor KAWAMURA, TOSHIOSUZUMURA, TAKASHIAIDA, MAKOTOSUGIMOTO, HIROSHITAKAHAGI, SHIGEHARUENDO, YUJUSASAKI, TOSHITAKASAKA, HIROYUKI
Owner HITACHI CABLE