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Adhesive material

a technology of adhesive materials and adhesives, applied in the field of adhesive materials, can solve the problems of insufficient attention to eradication and difficulty in concluding that the social need for safety has been properly satisfied, and achieve the effect of high biological safety

Inactive Publication Date: 2010-09-28
SONY CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0008]An object of the present invention, which is aimed at addressing the above-described problems of prior art, is to provide an adhesive material particularly suited to mounting elect

Problems solved by technology

Despite all these, insufficient attention has so far been paid to eradicating these problems with respect to conventional adhesive materials, making it difficult to conclude that the social need for safety has been properly satisfied.
In addition, environmental hormones (endocrine disruptors) that cause reproductive irregularities in living organisms (including humans) have recently become a cause for concern, but no arrangements have so far been made for manufacturing adhesive materials with full consideration for these effects.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

examples

[0026]The present invention will now be described in detail through examples.

examples 1-3

, Comparison Examples 1-2

[0027]Adhesive materials whose compositions are shown in Tables 1 and 2 were used, and anisotropically electroconductive films 30 μm in thickness were fabricated by a common technique.

[0028]Whereas the components used in Examples 1-3 were not confirmed to have any endocrine disruptive action, the radical-polymerizable compounds, curing agents, and thermoplastic resins used in Comparison Example 1 were confirmed to have a endocrine disruptive action, and similarly the radical-polymerizable compounds and thermoplastic resins used in Comparison Example 2 were not confirmed to have a endocrine disruptive action.

[0029]

TABLE 1 Muta-PHExamples (wt. pts)Componentgenicityvalue123Radical-polymerizable compoundPolypropylene glycol diacrylate+1negative0.0352015Neopentyl glycol dimethacrylate+2negative0.0—1510Phenol EO-modified acrylate+3negative0.0——10Curing agentPeroxydicarbonate+4negative— 5 5 5Thermoplastic resinPolyvinyl acetal+5negative—151515Saturated polyester+6n...

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PUM

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Abstract

The adhesive material contains a radical-polymerizable compound, a curing agent, and a thermoplastic resin; gives a negative result of the Ames test; and has a PII, or skin irritation, value of 2 or less. In particular, all the starting ingredients should preferably give a negative result of the Ames test and have a PII, or skin irritation, value of 2 or less.

Description

[0001]This application is a reissue continuation of Ser. No. 11 / 504,092 filed Aug. 15, 2006 abandoned, which is a reissue of Ser. No. 09 / 799,634, filed Mar. 7,2001, now U.S. Pat. No. 6,777,478.BACKGROUND OF THE INVENTION[0002]1. Field of the Invention[0003]The present invention relates to an adhesive material used for mounting bare IC chips and other electronic components on circuit boards.[0004]2. Description of the Related Art[0005]Insulating adhesives or anisotropically electroconductive adhesives in the form of pastes, liquids, or films are widely used as adhesive materials for the mounting of bare IC chips and other electronic components on circuit boards.[0006]Starting materials for manufacturing these adhesives are selected with consideration for their purchase price, ease of fabrication, connection reliability, storage stability, and the like. Typical examples of starting materials selected with consideration for such factors include radical-polymerizable compounds such as b...

Claims

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Application Information

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IPC IPC(8): B29C65/00C08F8/06C08J5/00C08L29/04D21H21/14C08L67/00C09B67/00C08J3/00C08L51/00C08K3/08C08C19/04B32B37/00C08F251/00C08F283/04C08F297/02C08G18/42C08G18/62C09J4/06C09J4/00C09J9/02C09J129/14C09J167/00C09J167/06H01L21/60
CPCC09J4/00C08F246/00C09J9/02
Inventor ISHIMATSU, TOMOYUKI
Owner SONY CORP
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