Shaped springs and methds of fabricating and using shaped springs
A technology of geometric shapes and components, applied in the direction of manufacturing measuring instruments, semiconductor/solid-state device manufacturing, components of electrical measuring instruments, etc., can solve problems such as the difficulty of interconnecting electrical connections
Inactive Publication Date: 2007-09-26
FORMFACTOR INC
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- Abstract
- Description
- Claims
- Application Information
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Problems solved by technology
[0010] As electronic components become smaller and the spacing between terminals on an electronic component becomes smaller (pitch taper), it becomes progressively more difficult to fabricate interconnects suitable for electrically connecting the terminals of an electronic component
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[0054] The present invention relates to interconnects including contacts. According to one aspect of the invention, at least initially, the interconnect comprises at least two materials, one or both of which are adapted to undergo a transformation to deform the shape of the interconnect. One example is where at least one material transitions from a first volume to a second, different volume, the volume transition causing the shape of the interconnect to change. An advantage of the interconnection of the present invention is that the structure can be formed to the desired shape, elasticity and spring constant according to simplified techniques.
[0055] In this manner, the present invention describes an interconnect having improved features over prior art interconnects, thereby enhancing the use of the present and future small form factor applications using the interconnect of the present invention. Applications include providing conductive paths between electronic components,...
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Abstract
An interconnection element and a method of fabricating and using an interconnect element that includes a first element material adapted to be coupled to a substrate and a second element material comprising a material having a transformable property such that upon transformation, a shape of the interconnection is modified. An example is a material that has a transformable property such that a volume of the first and / or second element material may undergo a thermal transformation from one volume to a different volume (such as a smaller volume).
Description
technical field [0001] The present invention relates to an interconnection (contact) suitable for operative connection between electronic components. Background technique [0002] Interconnects or contacts may be used to connect an arrangement of electronic components or one electronic component to another electronic component. For example, an interconnect may be used to connect two circuits of an integrated circuit chip or to connect an application specific integrated circuit (ASIC). Interconnects can also be used to connect integrated circuit chips to chip assemblies suitable for mounting on a printed circuit board (PCB) of a computer or other electronic device, or to connect integrated circuit chips directly to a PCB. The interconnects may also be used to connect the integrated circuit chip to a test device, such as a probe board assembly or other substrate, for testing the chip. [0003] In general, interconnections or contacts between electronic components can be divi...
Claims
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IPC IPC(8): H01L23/48G01R1/073G01R1/067G01R3/00H01L21/60H01L23/485H01R33/76
CPCH01L2924/09701H01L2924/01027H01L2924/10329H01L2924/1433H01L2924/01042H01L2924/01039H01L2924/01045H01L2924/01015H01L2924/01088H01L2924/01047H01L2924/01046H01L24/10H01L2924/01078H01L2924/01006H01L2924/01079H01L2924/01074G01R1/06761H01L2924/14H01L2924/01024H01L2924/0103H01L2924/01082H01L2224/13099H01L2924/01013H01L2924/01022H01L2924/01322H01L2924/0104G01R1/07342H01L24/72H01L2924/014H01L2924/01029G01R1/06744H01L2924/01094H01L2924/01019H01L2924/01033G01R3/00H01L2924/01075H01L24/11H01L24/13H01L2224/13H01L2924/0002H01L2924/15787H01L2924/00H01L23/48
Inventor G·L·马蒂厄B·N·埃尔德里奇S·W·文策尔
Owner FORMFACTOR INC