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Miniature device and component dissection method

A component and small-scale technology, which is applied in the field of component testing and analysis, can solve the problems of inability to retain bonding wires and external bonding points, achieve precise control of dissection time and temperature, improve dissection quality, and prevent over-corrosion effects

Inactive Publication Date: 2007-10-03
HUAWEI TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0011] The invention provides a method for dissecting small components to solve the problem in the prior art that the bonding wires and external bonding points cannot be preserved

Method used

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  • Miniature device and component dissection method
  • Miniature device and component dissection method
  • Miniature device and component dissection method

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Experimental program
Comparison scheme
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Embodiment Construction

[0026] Due to the very small volume of small components and various packaging forms, how to specifically dissect such small components will be described below in conjunction with accompanying drawing 2. As shown in Figure 2, it is a flow chart of the present invention, which includes the following main steps:

[0027] First, use epoxy resin and curing agent to prepare epoxy resin liquid.

[0028] The epoxy resin that adopts in the present invention refers to the epoxy resin that does not soften and deform above 100 DEG C. When making, add an appropriate amount of curing agent (such as: epoxy resin and curing agent) in the epoxy resin earlier. The weight ratio is 3:2); then stir evenly to form epoxy resin liquid.

[0029] Second, the epoxy resin liquid is poured into a mold equipped with components to be dissected, and after the resin is cured, it is baked and reinforced at a high temperature.

[0030] Put the component to be dissected into a special mold, place the "surface t...

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Abstract

The invention is a small component dissecting method, containing the steps: a, making epoxy resin solution by epoxy resin and firming agent; b, pouring the epoxy resin solution in the mould holding the component to be dissected and roasting at high temperature to reinforce after the resin solidifies; c, dissecting the epoxy resin block containing the component to be dissected; d, washing the dissected component, and judging if the component meets the demand, if does, finishing dissecting. It can fully retain interlinking wire and fully expose external interlinking point and sticking material, and make the dissecting time and control temperature very accurate; not easy to produce over-corrosion, especially applied to dissect gallium arsenide component; has wide applicability and strong practicability.

Description

technical field [0001] The invention relates to component testing and analysis technology, in particular to a method for dissecting small components. Background technique [0002] With the continuous development of communication technology and the increasing integration of integrated circuits, the high integration and miniaturization of communication systems has become a development trend. In order to meet the development trend of miniaturization of communication systems, it is inevitable to apply a large number of small components in communication systems. [0003] The so-called small components refer to components with a package area below 3mm×3mm, which are characterized by small package volume and many package forms. However, the large number of applications of small components makes the communication system miniaturized at the same time, but because of its own miniaturization, it becomes complicated and difficult to analyze the failure of components when they fail or f...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01N1/28H01L21/00
Inventor 邓永孝王宏全黄创君杜海涛
Owner HUAWEI TECH CO LTD