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Plastic package optical coupler dissection method

An optocoupler and laser technology, applied in the direction of material analysis using radiation, etc., can solve the problems of inability to perform bonding strength test and chip bonding analysis, etc., and achieve the effect of convenient control, simple method, and not easy to be corroded

Inactive Publication Date: 2018-02-02
XIAN MICROELECTRONICS TECH INST
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The technical problem to be solved by the present invention is to provide a plastic-encapsulated optocoupler dissection method for the above-mentioned deficiencies in the prior art, which solves the problem that the bonding strength test and chip bonding analysis cannot be performed after dissecting the plastic-encapsulated optocoupler with a three-dimensional structure. The problem is that after the optocoupler is dissected, the frame is complete, the chip is bonded and the bonding is complete, which can effectively expand the analysis capability of the plastic-encapsulated optocoupler, that is, the plastic-encapsulated optocoupler with a three-dimensional structure can also be used for bonding strength tests and chip bonding analysis.

Method used

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  • Plastic package optical coupler dissection method
  • Plastic package optical coupler dissection method
  • Plastic package optical coupler dissection method

Examples

Experimental program
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Embodiment

[0039] see figure 2 and image 3 , taking HCPL-0630-000E (three-dimensional structure) as an example, peel off the plastic sealing material on the front and rear sides to expose the tube legs and spacers of the optocoupler, and then peel off the plastic sealing material on the front and back sides, exposing from these two directions Take out the spacer to understand the external structure of the optocoupler;

[0040] Check the appearance of the plastic-encapsulated optocoupler by X-ray, understand the internal structure of the device, and prepare for subsequent unpacking;

[0041] Use a laser unsealing machine to partially remove the plastic encapsulation material in the four directions of the plastic encapsulated optocoupler, and separate the light emitting part and the receiving part of the plastic encapsulated optocoupler;

[0042] The appearance after removing the light-guiding glue of the light-emitting part and the receiving part of the plastic-encapsulated optocouple...

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Abstract

The invention discloses a plastic package optical coupler dissection method. The internal structure of a plastic package optical coupler is examined by X rays, the plastic package optical coupler is locally removed by a laser package removal machine, a luminous part and a receiving part of the plastic package optical coupler are separated from each other, a chip is soaked in concentrated sulfuricacid to remove light guiding glue on the surface of the chip, and thus, failing analysis and analysis of bonding strength and chip adhesion are realized. After dissection of the optical coupler is finished, a frame is complete, chip adhesion and bonding are complete, and the analysis ability of the plastic package optical coupler can be improved effectively, namely, the plastic package optical coupler which has a three-dimensional structure can be subjected to bonding strength testing and chip adhesion analysis.

Description

technical field [0001] The invention belongs to the technical field of chip analysis inside component packaging, and in particular relates to a method for dissecting a plastic-encapsulated optocoupler. Background technique [0002] With the in-depth development of semiconductor technology and optoelectronics, the application of optocouplers is becoming more and more extensive, and its development is also extremely rapid. The plastic-encapsulated optocoupler is a typical type of optocoupler, which is characterized by a special structure, a variety of types, and a light guide glue that is difficult to remove inside. At present, GJB4027A-2006 and GJB548B-2005 have no anatomical method for plastic-encapsulated optocouplers. The dissection of plastic-encapsulated optocouplers has always been our biggest problem. For optocouplers with three-dimensional structures, for a long time, the plastic-encapsulated optocoupler can only be removed by acid corrosion. Material and light guide...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01N23/02
CPCG01N23/02
Inventor 陈立刚
Owner XIAN MICROELECTRONICS TECH INST