Polymer micro chip hot bonding package method based on peltier heat circulation principle

Abstract

In the invention, semiconductor thermoelectricity refrigerator is use to heat polymer material to make surface of polymer covering board and base board being soften when temp. is near virtric, the polymer covering board and base board are combined to entirety by heat bonding to realize package of polymer microchip. Thermoelectricity refrigerator used by Palter heat cycling composed of a pair of N type and P type semiconductor units. On surface of refrigerator is heated, another surface is cooled by flowing of DC. Moving direction of heat quantity is reversed by changing polarity of power source to realize complete interchange cycling of heating and cooling. It is benefical to increase package efficiency that heating dand cooling time is shorted by using refrigerator based on palter heat cycling principle. Temp. changing cruve is more easier to exactly control temp. and increase package quality.

Description

technical field [0001] The invention relates to a polymer microchip thermal bonding encapsulation method based on the Pelpa thermal cycle principle. Background technique [0002] Both glass and silicon materials have excellent optical and electroosmotic properties, and have been widely used in the production of microsystem chips. However, the photolithography and etching techniques for making glass or silicon microsystem chips are tedious, time-consuming, and require an ultra-clean environment. Chip bonding is difficult, the material is fragile and the cost is high. Therefore, high molecular polymer has become an important material for making microsystem chips. Commonly used polymer materials are: polymethyl methacrylate (PMMA), polycarbonate (PC), polytetrafluoroethylene (Teflon), polyvinyl chloride (PVC), polydimethylsiloxane (PDMS), etc. . [0003] Packaging operations are widely used in micromachining, especially microsystem chip processing. It can permanently connect...

AI Technical Summary

Problems solved by technology

[0005] Laser heating packaging has the advantages of simple and fast process and high production efficiency, but its disadvantages are also obvious: (1) Laser heating packaging requires the cover material to be transparent and the substrate material to be opaque, so as to facilitate laser irradiation on the bonding surface, which makes the cover and substrate The range of sheet material selection is limited; if both are transparent materials, it is necessary to add an absorbing layer between the bonding surfaces or to treat the surface, which undoubtedly increases the difficulty of processing

(2) At the same time, due to the need to use relatively expensive excimer lasers, which are operated and used by professionals, this method is difficult to implement in ordinary laboratories, and the production cost is relatively expensive.

If a reasonable design can be used to overcome the shortcomings of resistance heating bonding, then such a microchip packaging process can be regarded as a low-cost, high-efficiency, high-quality packaging method

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