Line interface board and access apparatus fitted with same

Abstract

This invention discloses a circuit interface board of an access device including a handle strip, a PCB connected with the strip and multiple functional modules are set on the PCB characterizing that the PCB includes a base board and a pinch board, said functional boards are set on the base board and the pinch board communicating with each other by a connector.

Description

technical field [0001] The invention relates to communication equipment, in particular to a line interface board with high port density used in access equipment and access equipment equipped with the line interface board. Background technique [0002] In today's increasingly fierce market competition for access equipment (such as DSLAM, MSAN), in order to effectively reduce equipment costs and improve product competitiveness, equipment manufacturers usually reduce the The cost of the equipment. With the advancement of technology, the density of components has been continuously increased, and the power consumption of components has also been greatly reduced, which provides the possibility of increasing the density of circuit boards. [0003] At present, most manufacturers reduce equipment costs by increasing the port density of line interface boards. The cost of equipment can be effectively reduced by increasing the port density of the line interface board, but the current ...

AI Technical Summary

Problems solved by technology

The cost of equipment can be effectively reduced by increasing the port density of the line interface board, but the current method has the following problems: First, the PCB area of ​​the line interface board is limited, and after the component density is increased and the power consumption is reduced to a certain level, there is room for further development will gradually shrink, and the improvement of circuit board port density will also be limited

Secondly, for some component solutions, increasing the density of the line interface board will lead to an increase in the number of PCB layers, an increase in manufacturing process requirements, and a decrease in the maintainability of the board. In addition, the increase in power consumption and component density of the board will reduce the reliability of the board. The increase of single board power consumption makes the thermal design of the system more difficult. The result of these problems is the decrease of system reliability and the increase of implementation cost

Third, for the solution of directly leading the subscriber line from the single board, the increase in the density of the line interface board will increase the number or density of the subscriber line connectors used on the single board, and when the density reaches a certain level, the solution will not be realized

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