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2results about How to "Low manufacturing process requirements" patented technology

Atomizer and electronic atomization device

ActiveCN117122095Bsmooth dischargeContinuous dischargeMechanical engineeringMechanics
The application relates to an atomizer and an electronic atomization device, which comprise a suction nozzle, a shell, a soft bag and a liquid outlet valve mechanism; at least one air-permeable structure is arranged in the shell wall of the shell close to the suction nozzle, and a first liquid outlet is arranged in the shell wall of the end of the shell far from the suction nozzle; the soft bag is used for storing atomization liquid and is arranged in the shell, the soft bag expands or shrinks along with the amount of the stored atomization liquid, an end of the soft bag far from the suction nozzle is provided with a second liquid outlet, and the second liquid outlet is arranged in correspondence with the first liquid outlet; the liquid outlet valve mechanism comprises a liquid outlet valve and a supporting piece, the liquid outlet valve mechanism is used for opening or closing the second liquid outlet, and the supporting piece is connected with the liquid outlet valve. The atomizer can avoid dry burning and oil leakage, reduce the manufacturing process requirement and the process cost.
Owner:SHENZHEN INNOKIN TECHNOLOGY CO LTD

A method for encapsulating organic solid-liquid phase change materials

This application discloses a method for encapsulating organic solid-liquid phase change materials. The method includes the following steps: mixing phase change microcapsule powder, polymer, crosslinking agent, and water; reacting; washing with water; and drying to obtain the organic solid-liquid composite phase change material. This invention has low process requirements, does not use organic solvents, has minimal environmental pollution, and the prepared phase change profile has an adjustable shape, exhibiting characteristics such as no leakage, high heat storage density, and good stability, making it highly promising for applications in cold chain transportation and thermal management.
Owner:DALIAN INSTITUTE OF CHEMICAL PHYSICS CHINESE ACADEMY OF SCIENCES