Transducer assembly for semiconductor device testing processors
A technology of transmitters and semiconductors, applied in the direction of single semiconductor device testing, semiconductor/solid-state device testing/measurement, instruments, etc., can solve the problem that semiconductor devices cannot be installed on it
Inactive Publication Date: 2008-09-10
MIRAE CORPORATION
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[0009] However, although the prior art conveyor assembly 2 can sufficiently hold the semiconductor device D by the latches 23 when no balls Db or pins (not shown) are formed in many parts of the semiconductor device D, recently the semiconductor device D The trend of development shows that in the case where balls or pins are distributed around the entire bottom of the semiconductor device D, or when the size of the semiconductor device D is extremely small, when the semiconductor device is clamped by the clamp teeth 23 When the components of the prior art are not actually reliable enough, the prior art feeder assembly 2 cannot have the semiconductor device D mounted on it
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[0029] Preferred embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings.
[0030] Figure 3 to Figure 4C The conveyor assembly of the semiconductor device test processor according to a preferred embodiment of the present invention is illustrated, wherein the conveyor assembly 100 includes a conveyor assembly body 110, and a central part located at the lower side of the conveyor assembly body 110 for placing The device base 115 of the semiconductor device, one located on the opposite side of the base 115, respectively used to clamp the opposite side of the semiconductor device 101 and the first latch 140 and the second latch 150 below, also includes a movably mounted The latch button 130 on the upper part of the transmitter assembly body 110 is used to move the first latch 140 in an up-down direction.
[0031] The first locking tooth 140 is rotatably connected to the locking tooth button 130 through the first connec...
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This invention relates to semi-conductor parts test processor transmission parts, which comprises the following parts: one transport parts body; one part base socket located on transport parts; at least one pair of first card gear located socket relatively located to each other to clamp or release relative sides of the semi-conductor part; at least one pair of second card gear rotary located on the first card gear relative side to clamp the base socket located on the semi-conductor; card gear button located on the transport parts connected to one end of first gear along fluctuate direction; first spring part and second spring part to separately support the first and second gears.
Description
technical field [0001] The present invention relates to a conveyor assembly mounted on a test board of a processor for testing semiconductor devices, and more particularly, to a conveyor assembly for a semiconductor device testing processor capable of reliably loading semiconductor devices , and the semiconductor devices with pins or balls distributed around the bottom of those devices or small ball grid array (BGA) type semiconductor devices can be conveniently connected to the test slot of the test position of the device. Background technique [0002] Generally, a modular integrated circuit (the integrated circuit is a circuit in which memory or non-memory semiconductor devices are arranged on a board) is subjected to various tests after manufacture and before shipment. [0003] Usually, the test processor that is used for automatic testing semiconductor device and modular integrated circuit (modularIC) will go through the following steps in the process of testing: the wor...
Claims
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IPC IPC(8): H01R33/76G01R31/26G01R15/00H01L21/66
Inventor 咸哲镐李柄大宋镐根朴龙根
Owner MIRAE CORPORATION