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Static chuck

An electrostatic chuck and via technology, which is applied in the manufacture of circuits, electrical components, semiconductor/solid-state devices, etc., can solve the problem of insufficient heat conduction of the electrostatic chuck, and achieve the effect of lowering temperature, uniform temperature and increasing circulation.

Active Publication Date: 2008-09-17
BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In other words, the surrounding area of ​​the wafer is not sensitive to temperature, and the heat conduction effect of the electrostatic chuck cannot be fully obtained

Method used

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Embodiment Construction

[0019] The following examples are used to illustrate the present invention, but are not intended to limit the scope of the present invention. Those of ordinary skill in the relevant technical field can also make various changes and modifications without departing from the spirit and scope of the present utility model. Therefore, all equivalent technical solutions also belong to the category of the present invention, and the scope of patent protection of the present invention should be defined by each claim.

[0020] The electrostatic chuck of the present invention includes a ceramic insulating layer and a base, and a grooved gas passage is arranged on the ceramic layer. The gas passage is formed by connecting the circular passage 3 of the outer ring with the passage network 2, and the passage network is composed of three diameter passages and Two equilateral triangular passages are connected, and a central air hole 4 is set in the center of the gas passage lines. An outer edge...

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Abstract

This invention relates to a static chuck including an insulation layer and a base characterizing that round path and a gas through path net in the path and connected with it, said gas path net includes several symmetrically arranged diameter paths and several symmetrically arranged equilateral triangle paths and the three branch paths constituting the triangle path is in equal distance with that between parallel paths in the diameter path, a central gas hole is set at the center of the round path and outer edge gas holes are set at the cross place of the path net and the round path.

Description

technical field [0001] The invention relates to a semiconductor manufacturing process, in particular to an electrostatic chuck for fixing and supporting wafers in semiconductor manufacturing. Background technique [0002] In the semiconductor manufacturing process and LCD manufacturing process, in order to fix and support the wafer and avoid movement or misalignment during processing, an electrostatic chuck (ESC: Electrostatic chuck for short) is often used. The electrostatic chuck uses electrostatic attraction to hold the wafer, which has many advantages over the mechanical chuck and vacuum chuck used before. The electrostatic chuck reduces the damage of the wafer caused by pressure, collision and other reasons when using the mechanical chuck; increases the area where the wafer can be processed effectively; reduces the deposition of corrosion particles on the wafer surface; makes the wafer and the chuck better Conduct heat conduction; and can work in a vacuum environment, ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/683
Inventor 吉美爱
Owner BEIJING NAURA MICROELECTRONICS EQUIP CO LTD