Temperature control device
A temperature control device and constant temperature technology, applied in the field of control, can solve the problems of high price, lack of temperature adaptability, inability to run the main engine, etc., and achieve the effect of enhancing adaptability, good working temperature environment, and enhancing temperature adaptability.
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Embodiment 1
[0037] according to figure 1 , figure 2 and image 3 , the present invention includes a heat-insulating warehouse body 1, an external heat-exchanging body 2 and a semiconductor refrigeration block 3, the heat-insulating chamber body 1 communicates with the external heat-exchanging body 2 and performs heat exchange, and the heat-insulating chamber body 1 and the external heat-exchanging body 2 A semiconductor refrigeration block 3 is arranged between them, and the semiconductor refrigeration block 3 performs correspondingly compensated heat exchange between the heat-insulating chamber body 1 and the external heat-exchanging body 2 to maintain a constant temperature of the heat-insulating chamber body 1 .
[0038] like figure 2 As shown, a temperature sensor 101 is arranged in the heat insulation bin body 1, such as Figure 7 As shown, a corresponding main control module 4 is set in the present invention, and the main control module 4 controls the on-off and connection pola...
Embodiment 2
[0053] according to Figure 8 and Figure 9 The difference between this embodiment and Embodiment 1 is that in this embodiment, the external heat exchange body 2 includes a third heat exchange block 21 and a fan 22, the third heat exchange block 21 is attached to the semiconductor refrigeration block 3, and the second The three heat exchange blocks 21 and the fan 22 are placed in a protective case 23, and the protective case 23 has openings at both ends.
[0054] The fan 22 helps to speed up temperature adjustment, and the protective shell 23 plays a role in protecting the third heat exchange block 21 and the fan 22, and the openings at both ends actually form an air duct, which further improves the practicability of the present invention.
[0055] As for other partial structures, principles, and methods that are the same or similar to those described in Embodiment 1, details will not be repeated here.
Embodiment 3
[0057] according to Figure 10 and Figure 11 , the difference between this embodiment and embodiment 2 lies in the following points:
[0058] 1) if Figure 11 As shown, in this embodiment, a pulse width modulation module 7 is also connected between the interface between the semiconductor refrigeration block 3 and the power supply 5 , and the main control module 4 sends a pulse width modulation signal to the pulse width modulation module 7 to adjust the current output.
[0059] 2) if Figure 10 As shown, in this embodiment, temperature sensors are provided at key parts of the heat insulation chamber body 1 and the external heat exchange body 2, and the specific settings are as follows:
[0060] In the heat insulation bin body 1: a temperature sensor 101 is set on the upper part of the inner bin 111; a temperature sensor 102 is set on the first heat exchange block 12; a temperature sensor 103 is set on the collective circuit 116 (the bottom of the first heat exchange block 1...
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