Air tight high-heat conducting chip packaging assembly

Abstract

A gas-tight packaging component for a high heat-conduction chip includes a base, a base plate, a CB, a chip, a light-transmission shade and a covering glue, among which, the base plate is set with a through hole for setting the base, a position hole and an injection hole, the CB has a through hole for setting the base, a positioning hole and an hole for setting the base, a positioning hole and an injection hole and a loop is distributed on its surface, the upper and lower parts of the base are a vertical column with a smaller cross section and a disk base with a large cross section, the top of the column is processed to a concave cup slot for implanting chips, which is in the slot and connected with the surface loop of the CB by lead, positioning pins are set at the bottom of the shade corresponding to and implanted in the position holes, the shade covers the chip, lead and the injection hole to be filled to form a covering glue.

Description

technical field [0001] The invention belongs to a semiconductor package assembly, in particular to an airtight high thermal conductivity chip package assembly. Background technique [0002] In the field of conventional technology, light emitting diodes (LEDs; Light Emitted Diode) can be applied to single or array packaging technology as shown in Figure 1. The groove B1 is placed into the lamp cup C, the chip D is implanted in the lamp cup C, and connected to the circuit board B with the wire E, and the epoxy resin F (Epoxy) is poured into the mold to cover the circuit of the chip D and the wire E. [0003] However, this packaging technology has been found to have the following deficiencies after actual use: [0004] Poor heat dissipation: Epoxy resin F and circuit board B (Pcb) have the effect of heat insulation, and the only place that can conduct heat is under the lamp cup C. Due to the limited heat dissipation area, the heat exchange efficiency through this single point ...

AI Technical Summary

Problems solved by technology

[0004] Poor heat dissipation: Epoxy resin F and circuit board B (Pcb) have the effect of heat insulation, and the only place that can conduct heat is under the lamp cup C. Due to the limited heat dissipation area, the heat exchange efficiency through this single point is poor, and The other parts are made of epoxy resin F and other adhesive materials. Surrounded by such materials, a nearly heat-insulating and closed environment is formed. When the chip D functions to emit light, the central light-emitting layer generates heat as high as nearly 200°C. The heat cannot be dissipated due to the coating of epoxy resin F, so it is easy to show the illusion of no heat, which leads to the name of light-emitting diodes as cold light, but in the state of insufficient heat exchange efficiency, it is easy to affect the luminous power and use of chip D life

[0005] High cost and few changes: The mold set used when pouring epoxy resin F to cover the chip D and wire E circuit must be high-precision, and the manufacturing cost cannot be reduced. products, it is necessary to make a relatively higher cost mold set to match

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