Automatic glass top chip jointer
A chip-on-glass and bonder technology, which is applied in the direction of assembling printed circuits of instruments, optics, and electrical components, can solve the problems of prolonged production time, prolonged processing time, low work efficiency, etc., and achieve the effect of simple structure
Inactive Publication Date: 2009-02-18
SFA ENG CORP
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Problems solved by technology
Therefore, a lot of manpower is required for chip bonding work, and work efficiency is low
That is, as the production time per unit of product for bonding the chip to the LCD panel increases, the overall processing time also increases, resulting in low work efficiency.
In addition, since the processing relies on the manual operation of the workers, the accuracy of the work is low, which increases the rate of defective products
Method used
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[0056] A full understanding of the invention, the value of the invention, and the objects achieved by the practice of the invention can be obtained by referring to the accompanying drawings for illustrating preferred embodiments of the invention.
[0057] Hereinafter, the present invention will be described in detail by explaining preferred embodiments of the invention with reference to the accompanying drawings. Like reference numerals denote like elements in the drawings.
[0058] like figure 1 As shown, an automatic COG (chip on glass) bonder 1 according to an embodiment of the present invention includes a panel supply module 100, a conductive film attachment module 200, a plurality of panel transfer modules 300, 500, 800 and 1000, a pre-bonding module 400, Chip supply module 600 , main bonding module 700 and panel unloading module 900 . In this embodiment, the panel transfer module is composed of the first panel transfer module 300, the second panel transfer module 500, ...
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An automatic glass top chip jointer comprises: a panel supply module for continuously supplying the panels; a conductive film adhesive module disposed adjacent to the panel supply module for attaching the conductive film to the chip joint position on the panel; a pre-joint module disposed adjacent to the conductive film adhesive module for temporarily jointing the chip to chip joint position on the panel wherein the conductive film is attached; a chip supply module disposed adjacent to the pre-joint module for continuously supplying the chips to the pre-joint module; a main joint module disposed adjacent to the pre-joint module for completely jointing the chip to the panel; a panel unload module disposed adjacent to the main joint module for unloading the panel to the exterior; and a panel transport module for transporting the panel to the next module. The conductive film adhesive module, pre-joint module and main joint module are disposed in pipeline wherein the panels transported in a constant rate from the panel transport module are continuously processed in a constant rate.
Description
technical field [0001] The present invention relates to an automatic COG (chip on glass) bonder, and more particularly, to an automatic bonder that can automate the process of bonding semiconductor chips (such as driver ICs) to the bonding surface of an LCD (liquid crystal display) panel. COG Adapter. Background technique [0002] Currently, as LCD devices become thinner and lighter, a COG method in which a semiconductor chip for driving an LCD panel is directly bonded to a TFT glass has been widely used. When the semiconductor chip is directly bonded to the glass, no complicated wiring is required, so that no separate wiring space is required. Therefore, the COG method is now widely used. [0003] Conventional COG splicers are manual type, so workers need to directly supply LCD panels one by one. Therefore, a large amount of manpower is required for chip bonding work, and work efficiency is low. That is, as the unit product production time for bonding chips to the LCD p...
Claims
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IPC IPC(8): G02F1/1333
CPCG02F1/13452G02F2201/465H05K3/36
Inventor 陈明出
Owner SFA ENG CORP